Solder paste is a type of adhesive material that is used in the process of soldering. It is a mixture of fine solder particles (typically tin and lead), flux, and a binding agent. Solder paste is used in surface mount technology (SMT) to attach components to printed circuit boards (PCBs). The paste is placed onto the PCB using a stencil, and the components are then placed onto the paste. The assembly is then heated, causing the solder to melt and create a strong mechanical and electrical connection between the component and the PCB. The flux in the paste helps to remove oxides and other impurities from the surfaces of the components and PCB, promoting a strong and reliable connection.

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