The R-5795(U) from Panasonic is a Multi-Layer Circuit Board Material that is designed for use in ICT infrastructure equipment. It has a glass transition temperature of 220°C and a thermal decomposition temperature of 370°C. This material boasts excellent time to delamination (>60 min) with Cu, and its CTE ranges from 17-20 ppm/°C for X and Y axes, 50 ppm/°C for &alpha1 Z-axis, and 270 ppm/°C for &alpha2 Z-axis, as per IPC-TM-650 2.4.24. It has a balanced-type circular disk resonator that exhibits a low dielectric constant of 3.08 and has a dissipation factor of 0.0012 at 14 GHz. The material has low water absorption (0.06%) and meets the flammability requirement of UL-C-48/23/50 (94V-0). The sample thickness is 0.75mm and its peel strength, according to IPC-TM-650 2.4.8, is 0.7 kN/m for 1oz(H-VLP3).