Wave Soldering Equipment

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Flason Electronic Co.,ltd - FLASON N250

Wave Soldering Equipment from Flason Electronic Co.,ltd

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Solder Pot Capacity: 220 kg
Preheat Zones: 2 Zones
PCB Size: 50-250mm
General Power: 11KW
Power Supply: 380V 6KW
Net Weight: 700KG
Overall Dimensions: 1800(L)*1200(W)*1600(H)

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Madell Technology Corporation - MD-350PC

Wave Soldering Equipment from Madell Technology Corporation

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Solder Pot Capacity: 400 kg
Preheat Zones: 4 Zones
PCB Size: 350 mm
Flux Volume: 5.2 L
General Power: 23 kW
Power Supply: 3 phase, 5 lines, 380V (or 220V)
Net Weight: 1350 kg
Overall Dimensions: 4.3 x 1.36 x 1.68 m

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Kurtz Ersa - POWERFLOW ULTRA

Wave Soldering Equipment from Kurtz Ersa

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Solder Pot Capacity: 525 to 725 kg
Wave Width: up to 406 mm
PCB Size: up to 150 mm
Overall Dimensions: 7200 x 1400 x 1580 mm

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TAMURA Corporation - TNW40-36EF

Wave Soldering Equipment from TAMURA Corporation

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Solder Pot Capacity: 370 kg
PCB Size: 120 x 50, 450 x 400 mm
Power Supply: AC 200 V±10% - 50/60 Hz
Net Weight: 1850 kg
Overall Dimensions: 3600 x 1470 x 1860 mm

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Shenzhen Weldsmt Machinery Co., Ltd - W-350DS-LF-C

Wave Soldering Equipment from Shenzhen Weldsmt Machinery Co., Ltd

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Wave: Dual Wave
Solder Pot Capacity: 350 kg
Preheat Zones: 3 Zones
PCB Size: 350 mm
PCB Direction: Left to Right, Right to Left
Flux Volume: 5.2 litres
General Power: 25 kW
Power Supply: 3 Phase 380V
Air Supply: 4 to 7 kg/cm2, 12.5 L/min
Net Weight: 2200 kg
Overall Dimensions: 3800 x 1350 x 1650 mm

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Shenzhen Weida Electronic Equipment Co., Ltd - V-300C

Wave Soldering Equipment from Shenzhen Weida Electronic Equipment Co., Ltd

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Wave: Dual Wave
Solder Pot Capacity: 300 kg
Solder Temperature: 300 Degree C
Preheat Zones: 3 Zones
PCB Size: 50 to 300 mm
PCB Direction: Left to Right, Right to Left
Flux Volume: 6 litres
General Power: 22 kW
Power Supply: 3P AC 380V 50 Hz 63A
Air Supply: 20 cubic/min 2 (channel) ∮ 240 mm
Net Weight: 1300 kg
Overall Dimensions: 3950 x 1200 x 1700 mm

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Flason Electronic Co.,ltd - FLASON N300

Wave Soldering Equipment from Flason Electronic Co.,ltd

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Solder Pot Capacity: 280 kg
Preheat Zones: 3 Zones
PCB Size: 50-300mm
General Power: 19KW
Net Weight: 1000KG
Overall Dimensions: 2800(L)*1250(W)*1560(H)

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Madell Technology Corporation - MD-300DS

Wave Soldering Equipment from Madell Technology Corporation

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Solder Pot Capacity: 350 kg
Preheat Zones: 1 Zone
PCB Size: 300 mm
Flux Volume: 5.2 L
General Power: 25 kW
Power Supply: 3 phase, 5 lines, 380V
Net Weight: 1000 kg
Overall Dimensions: 2.6 x 1.2 x 1.6 m

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Kurtz Ersa - POWERFLOW

Wave Soldering Equipment from Kurtz Ersa

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Solder Pot Capacity: 820 kg
Wave Width: up to 508 mm
PCB Size: up to 120 mm
Net Weight: 3,000 kg
Overall Dimensions: 4950 x 1510 x 1565 mm

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TAMURA Corporation - TNW33-36EX/ET

Wave Soldering Equipment from TAMURA Corporation

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Solder Pot Capacity: 490 kg
PCB Size: 120 x 5, 400 x 330 mm
Power Supply: AC 200 V±10% - 50/60 Hz
Net Weight: 1850 kg
Overall Dimensions: 3600 x 1400 x 1860 mm

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Wave Soldering Equipment

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Flason Electronic Co.,ltd - FLASON N250

Madell Technology Corporation - MD-350PC

Kurtz Ersa - POWERFLOW ULTRA

TAMURA Corporation - TNW40-36EF

Shenzhen Weldsmt Machinery Co., Ltd - W-350DS-LF-C

Shenzhen Weida Electronic Equipment Co., Ltd - V-300C

Flason Electronic Co.,ltd - FLASON N300

Madell Technology Corporation - MD-300DS

Kurtz Ersa - POWERFLOW

TAMURA Corporation - TNW33-36EX/ET

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