Wave Soldering Equipment

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Flason Electronic Co.,ltd - FLASON N250

Wave Soldering Equipment from Flason Electronic Co.,ltd

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Solder Pot Capacity: 220 kg
Preheat Zones: 2 Zones
PCB Size: 50-250mm
General Power: 11KW
Power Supply: 380V 6KW
Net Weight: 700KG
Overall Dimensions: 1800(L)*1200(W)*1600(H)

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GrandSeed (Hong Kong) International Co.,Ltd - GB-N315S

Wave Soldering Equipment from GrandSeed (Hong Kong) International Co.,Ltd

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Wave: Dual Wave
Solder Pot Capacity: 180 kg
PCB Size: 30 - 300 mm
PCB Direction: Left to Right
Flux Volume: 6 litres
General Power: 15 kW
Power Supply: AC 380V, 50 Hz
Air Supply: 3 - 5 bar
Net Weight: 655 kg
Overall Dimensions: 2650 x 1200 x 1450 mm

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Madell Technology Corporation - MD-350PC

Wave Soldering Equipment from Madell Technology Corporation

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Solder Pot Capacity: 400 kg
Preheat Zones: 4 Zones
PCB Size: 350 mm
Flux Volume: 5.2 L
General Power: 23 kW
Power Supply: 3 phase, 5 lines, 380V (or 220V)
Net Weight: 1350 kg
Overall Dimensions: 4.3 x 1.36 x 1.68 m

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Kurtz Ersa - POWERFLOW ULTRA

Wave Soldering Equipment from Kurtz Ersa

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Solder Pot Capacity: 525 to 725 kg
Wave Width: up to 406 mm
PCB Size: up to 150 mm
Overall Dimensions: 7200 x 1400 x 1580 mm

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Global Chang Rong Ltd - 06D350

Wave Soldering Equipment from Global Chang Rong Ltd

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Wave: Dual Wave
Solder Pot Capacity: 220 kg
Solder Temperature: Ambient - 300 Degree C
Wave Width: 360 mm
Preheat Zones: 1 Zone
PCB Size: 50 - 350 mm
General Power: 18 kW
Power Supply: 3 φ, 380 V,50 Hz or 3PH 220V
Air Supply: 5 - 6 kg/cm² (4 - 6 bar)
Net Weight: 920 kg
Overall Dimensions: 2820 x 1500 x 1880 mm

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Shenzhen Weldsmt Machinery Co., Ltd - W-350DS-LF-C

Wave Soldering Equipment from Shenzhen Weldsmt Machinery Co., Ltd

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Wave: Dual Wave
Solder Pot Capacity: 350 kg
Preheat Zones: 3 Zones
PCB Size: 350 mm
PCB Direction: Left to Right, Right to Left
Flux Volume: 5.2 litres
General Power: 25 kW
Power Supply: 3 Phase 380V
Air Supply: 4 to 7 kg/cm2, 12.5 L/min
Net Weight: 2200 kg
Overall Dimensions: 3800 x 1350 x 1650 mm

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Flason Electronic Co.,ltd - FLASON N300

Wave Soldering Equipment from Flason Electronic Co.,ltd

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Solder Pot Capacity: 280 kg
Preheat Zones: 3 Zones
PCB Size: 50-300mm
General Power: 19KW
Net Weight: 1000KG
Overall Dimensions: 2800(L)*1250(W)*1560(H)

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GrandSeed (Hong Kong) International Co.,Ltd - GB-WD351C

Wave Soldering Equipment from GrandSeed (Hong Kong) International Co.,Ltd

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Wave: Dual Wave
Solder Pot Capacity: 350 kg
Solder Temperature: Room - temperature - 300 Degree C
Preheat Zones: 3 Zones
PCB Size: 30 - 350 mm
PCB Direction: Left to Right
Flux Volume: 6 litres
General Power: 25 kW
Power Supply: AC 380V, 50 Hz
Air Supply: 3 - 5 bar
Net Weight: 1180 kg
Overall Dimensions: 3400 x 1400 x 1700 mm

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Madell Technology Corporation - MD-300DS

Wave Soldering Equipment from Madell Technology Corporation

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Solder Pot Capacity: 350 kg
Preheat Zones: 1 Zone
PCB Size: 300 mm
Flux Volume: 5.2 L
General Power: 25 kW
Power Supply: 3 phase, 5 lines, 380V
Net Weight: 1000 kg
Overall Dimensions: 2.6 x 1.2 x 1.6 m

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Kurtz Ersa - POWERFLOW

Wave Soldering Equipment from Kurtz Ersa

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Solder Pot Capacity: 820 kg
Wave Width: up to 508 mm
PCB Size: up to 120 mm
Net Weight: 3,000 kg
Overall Dimensions: 4950 x 1510 x 1565 mm

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Wave Soldering Equipment

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Flason Electronic Co.,ltd - FLASON N250

GrandSeed (Hong Kong) International Co.,Ltd - GB-N315S

Madell Technology Corporation - MD-350PC

Kurtz Ersa - POWERFLOW ULTRA

Global Chang Rong Ltd - 06D350

Shenzhen Weldsmt Machinery Co., Ltd - W-350DS-LF-C

Flason Electronic Co.,ltd - FLASON N300

GrandSeed (Hong Kong) International Co.,Ltd - GB-WD351C

Madell Technology Corporation - MD-300DS

Kurtz Ersa - POWERFLOW

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