Wave Soldering Equipment

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Flason Electronic Co.,ltd - FLASON N250

Wave Soldering Equipment from Flason Electronic Co.,ltd

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Solder Pot Capacity: 220 kg
Preheat Zones: 2 Zones
PCB Size: 50-250mm
General Power: 11KW
Power Supply: 380V 6KW
Net Weight: 700KG
Overall Dimensions: 1800(L)*1200(W)*1600(H)

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Kurtz Ersa - POWERFLOW ULTRA

Wave Soldering Equipment from Kurtz Ersa

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Solder Pot Capacity: 525 to 725 kg
Wave Width: up to 406 mm
PCB Size: up to 150 mm
Overall Dimensions: 7200 x 1400 x 1580 mm

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HB Automation Equipment Co.Ltd - HW-350

Wave Soldering Equipment from HB Automation Equipment Co.Ltd

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Wave: Dual Wave
Solder Pot Capacity: 480 kg
Solder Temperature: 300 Degree C
PCB Size: 500 x 450 mm
PCB Direction: Left to Right
Flux Volume: 10 to 100 ml/min
General Power: 26 kW
Power Supply: 3P5W,380V /220 V , 50/60HZ 63A
Air Supply: 2.5 to 4 bar
Net Weight: 2300 kg
Overall Dimensions: 4430 x 1620 x 1710 mm

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Shenzhen Weida Electronic Equipment Co., Ltd - V-300C

Wave Soldering Equipment from Shenzhen Weida Electronic Equipment Co., Ltd

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Wave: Dual Wave
Solder Pot Capacity: 300 kg
Solder Temperature: 300 Degree C
Preheat Zones: 3 Zones
PCB Size: 50 to 300 mm
PCB Direction: Left to Right, Right to Left
Flux Volume: 6 litres
General Power: 22 kW
Power Supply: 3P AC 380V 50 Hz 63A
Air Supply: 20 cubic/min 2 (channel) ∮ 240 mm
Net Weight: 1300 kg
Overall Dimensions: 3950 x 1200 x 1700 mm

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Flason Electronic Co.,ltd - FLASON N300

Wave Soldering Equipment from Flason Electronic Co.,ltd

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Solder Pot Capacity: 280 kg
Preheat Zones: 3 Zones
PCB Size: 50-300mm
General Power: 19KW
Net Weight: 1000KG
Overall Dimensions: 2800(L)*1250(W)*1560(H)

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Kurtz Ersa - POWERFLOW

Wave Soldering Equipment from Kurtz Ersa

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Solder Pot Capacity: 820 kg
Wave Width: up to 508 mm
PCB Size: up to 120 mm
Net Weight: 3,000 kg
Overall Dimensions: 4950 x 1510 x 1565 mm

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HB Automation Equipment Co.Ltd - HW-450

Wave Soldering Equipment from HB Automation Equipment Co.Ltd

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Wave: Dual Wave
Solder Pot Capacity: 480 kg
Solder Temperature: 300 Degree C
PCB Size: 500 x 450 mm
PCB Direction: Left to Right
Flux Volume: 10 to 100 ml/min
General Power: 26 kW
Power Supply: 3P5W,380V /220 V , 50/60HZ 63A
Air Supply: 2.5 to 4 bar
Net Weight: 2300 kg
Overall Dimensions: 4430 x 1620 x 1710 mm

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Shenzhen Weida Electronic Equipment Co., Ltd - V - 250A

Wave Soldering Equipment from Shenzhen Weida Electronic Equipment Co., Ltd

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Solder Pot Capacity: 200 kg
Solder Temperature: 300 Degree C
Preheat Zones: 2 Zones
PCB Size: 50 to 250 mm
PCB Direction: Left to Right, Right to Left
Flux Volume: 6 litres
General Power: 15 kW
Power Supply: 3P AC 380V 50 Hz 63A
Air Supply: 15 cubic/min 2 (channel) ∮ 190 mm
Net Weight: 800 kg
Overall Dimensions: 2880 x 1100 x 1700 mm

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Flason Electronic Co.,ltd - Flason N450

Wave Soldering Equipment from Flason Electronic Co.,ltd

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Solder Pot Capacity: 420 kg
Preheat Zones: 4 Zones
PCB Size: 60-350mm
General Power: 30KW
Power Supply: 3P5W,380/220V 50Hz 63A
Net Weight: 1500KG
Overall Dimensions: 4300(L)*1400(W)*1560(H)

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Kurtz Ersa - POWERFLOW ULTRA XL

Wave Soldering Equipment from Kurtz Ersa

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Solder Pot Capacity: 525 to 725 kg
Wave Width: up to 520 mm
PCB Size: up to 150 mm
Overall Dimensions: 7200 x 1515 x 1580 mm

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Wave Soldering Equipment

Selected FiltersReset All

Flason Electronic Co.,ltd - FLASON N250

Kurtz Ersa - POWERFLOW ULTRA

HB Automation Equipment Co.Ltd - HW-350

Shenzhen Weida Electronic Equipment Co., Ltd - V-300C

Flason Electronic Co.,ltd - FLASON N300

Kurtz Ersa - POWERFLOW

HB Automation Equipment Co.Ltd - HW-450

Shenzhen Weida Electronic Equipment Co., Ltd - V - 250A

Flason Electronic Co.,ltd - Flason N450

Kurtz Ersa - POWERFLOW ULTRA XL

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