Depaneling Equipment by Asys Group Americas Inc (10 more products)

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The DIVISIO 6000 from Asys Group Americas is an Automated Depanelizing Equipment. It supports PCBs measuring 20 to 460 mm in length, 0.8 to 5 mm in thickness and a maximum component height of 40 mm. This equipment has two carbon axes in parallel and achieves a cycle time of under 2.5 seconds per circuit. It is customized for specific processes and uses either a shuttle system or a rotary table. The equipment utilizes a quick-change adapter system that enables swift changeovers for equipping product-specific carriers. The double gripper enhances efficiency by simultaneously routing two circuits on the transport system.

The DIVISIO 6000 integrates the final assembly processes to reduce space requirements, eliminate networking costs, and significantly shorten installation times. It supports various processes, including screwing, pressing, dispensing, riveting, laser marking, LED color matching, testing (e.g., ICT/FKT), flipping, and customer-specific tasks. This equipment is available in an enclosure that measures 1200 x 2960 x 1688 mm and requires an AC supply of 400 V/208 V.

Product Specifications

Product Details

  • Part Number
    DIVISIO 6000
  • Manufacturer
    Asys Group Americas Inc
  • Description
    Precision Automated Depanelizing for Efficient Electronic Assembly

General Parameters

  • Depaneling Mode
  • PCB Thickness
    0.8 to 5 mm
  • Max Board Length
    20 to 460 mm
  • Max Board Width
    20 to 460 mm
  • Max Component Height
    40 mm
  • Power Supply
    400 V, 208 V 50 / 60 Hz, ± 10%
  • Net Weight
    2800 kg
  • Overall Dimensions
    1200 x 2960 x 1688 mm

Technical Documents

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