The 1000 BR EVO2 by Cencorp Automation is a Motorized Depaneling Equipment for efficient PCB separation and packaging process. It supports a maximum board dimension of 400 x 350 mm, where the PCB thickness should not exceed 5 mm. The motorized arm of the equipment separates printed circuit boards from the main board at a speed of 2000 mm/s. It requires an air pressure ranging from 5 to 7 bars within the temperature range of 10 to 40°C. This equipment is available in an enclosure that measures 2225 x 1000 x 1950 mm and requires an AC supply of 400 V.
The BR EVO2 is an advanced PCB depaneling solution and includes options like a flexible servo gripper, dedicated multi-gripper, or a combination of both. It features optical routing verification, improved dust extraction, and advanced cleaning functions to ensure top-notch process performance. The unique frame design of this equipment allows easy configuration of output, and extensive software options, including CAD import, MES connectivity, and traceability, meet the most stringent quality demands in the electronics industry.