VP9000 High-speed Machine

The VP9000 High-speed Machine from Omron Corporation is a 3D Solder Paste Inspection (SPI) equipment that uses a phase shift method for post-SMT screen printing inspection. It can accommodate PCBs measuring from 50 x 50 mm to 510 x 460 mm with thicknesses varying from 0.3 to 5 mm. This SPI equipment has multiple inspection resolution settings - 25/12.5/8.5 μm, 20/10/7 μm, and 15/7.5/5 μm - which can be selected using a digital switching method. It has an inspection speed of 700 to 9400 mm2/sec.  

The VP9000 High-speed Machine uses a 360° ring light source that projects against inspection objects (solder paste) and performs three-dimensional measurements to achieve reliable inspections. It has a 3D projector that illuminates the solder paste with a stripe pattern which is then captured by the camera. Depending on the height of the solder paste, the projected line pitch and pattern will change. Through a method of triangulation, the software can calculate solder height information from these lines. This SPI machine also has an auto-focus Z-axis function for greater accuracy on varying board surfaces and also automatically compensates for PCB warpage in each field of view.  

The VP9000 High-speed Machine is equipped with a friendly touchscreen interface and delivers real-time feedback for operators. This SPI system has a footprint of 904 x 1180 x 1600 mm.