BGA PCB Assembly
BGAs (Ball Grid Arrays) are SMD components with connections on the bottom, where each connection is provided with a dedicated solder ball that connects the package body and base. All these connections are distributed uniformly via surface grid on the component.
BGAs use surface-mount technique that reduces the package size by providing more interconnection on a single chip module. BGAs are generally used to design miniature package for ICs to add more functionality, which results in improved operating speed. They can be soldered using precisely-controlled reflow soldering process.
PCB Directory has listed assembly companies that provide BGA PCB Assembly services. The list of BGA PCB Assembly companies can be filtered further based on their location and capabilities.