Solder Paste Inspection Equipment

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Dongguan ICT Technology Co.,Ltd - I.C.T-S400D

Solder Paste Inspection Equipment from Dongguan ICT Technology Co.,Ltd

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Field of View: 28 mm, 35 mm, 37 mm, 41 mm
Defects: Bridge, Offset
Measurement: 180 μm
PCB Size: 450 x 310 mm
Camera: 530 M
3D Technology: Yes
Net Weight: 1300 kg

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MIRTEC - MS-15DL

Solder Paste Inspection Equipment from MIRTEC

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Measurement: Height, Volume / Area, Solder Bridge, X/Y Offset, ...
PCB Size: 50 x 50 to 460 x 590 mm
PCB Weight: 4 kg
Camera: 25 MP
3D Technology: Dual Projection Shadow Free Moiré Phase Step Image...
Bottom Clearance: 50 mm
Edge Clearance: 3 mm
Net Weight: 1400 Kg

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ViTrox Corporation Berhad - V310i Optimus

Solder Paste Inspection Equipment from ViTrox Corporation Berhad

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Field of View: 22.5 x 22.5 mm
Defects: Height, Offset, Volume, Bridge
PCB Size: 470 x 500 mm
PCB Thickness: 0.2 to 4 mm
PCB Weight: 3 kg
Camera: 25 MP
3D Technology: Yes
Top Clearance: 10 mm
Bottom Clearance: 70 mm
Edge Clearance: 3.5 mm

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Dongguan ICT Technology Co.,Ltd - I.C.T-S600

Solder Paste Inspection Equipment from Dongguan ICT Technology Co.,Ltd

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Field of View: 35 mm, 37 mm
Measurement: 180 - 180 um
PCB Size: 55 x 55 - 450 x 310 mm Dual
PCB Thickness: 0.5 - 5.0 mm
PCB Weight: ≤ 5.0 kg
Camera: 530 M
Net Weight: 1300 kg

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MIRTEC - MS-15U

Solder Paste Inspection Equipment from MIRTEC

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Measurement: Height, Volume / Area, Solder Bridge, X/Y Offset, ...
PCB Size: 50 x 50 to 610 x 660 mm
PCB Weight: 4 kg
Camera: 15 MP
3D Technology: Dual Projection Shadow Free Moiré Phase Step Image...
Bottom Clearance: 50 mm
Edge Clearance: 3 mm
Net Weight: 1500 Kg

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ViTrox Corporation Berhad - V310i FDL

Solder Paste Inspection Equipment from ViTrox Corporation Berhad

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Field of View: 40 x 40 mm
Defects: Bridge, Offset, Missing Paste
PCB Size: 510 x 510 mm
PCB Thickness: 0.5 to 4 mm
PCB Weight: 3 kg
Camera: 4 MP
3D Technology: Phase Shift Profilometry’s (PSP) Methodology
Top Clearance: 50 mm
Bottom Clearance: 70 mm
Edge Clearance: 3.5 mm
Conveyor Height: 875 to 965 mm
Net Weight: 900 kg

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Dongguan ICT Technology Co.,Ltd - I.C.T-S1200

Solder Paste Inspection Equipment from Dongguan ICT Technology Co.,Ltd

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Field of View: 41 mm
Measurement: 180 - 180 um
PCB Size: 55 x 55 - 1200 x 650 mm
PCB Thickness: 0.5 - 5.0 mm
PCB Weight: ≤ 5.0 kg
Camera: 530 M
Net Weight: 1600 kg

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MIRTEC - MS-11em

Solder Paste Inspection Equipment from MIRTEC

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Solder Paste Inspection Precision for PCB Dimensions up to 280 x 300 mm

Measurement: Height, Volume / Area, Solder Bridge, X/Y Offset, ...
PCB Size: 50 x 50 to 280 x 330 mm
PCB Weight: 4 kg
Camera: 25 MP
3D Technology: Dual Projection Shadow Free Moiré Phase Step Image...
Bottom Clearance: 50 mm
Edge Clearance: 3 mm
Net Weight: 870 Kg

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ViTrox Corporation Berhad - V310i Standard

Solder Paste Inspection Equipment from ViTrox Corporation Berhad

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Field of View: 60 x 45 mm, 53 x 39 mm, 32 x 24 mm
Defects: Offset, Height, Bridge
PCB Size: 510 x 503 mm
PCB Thickness: 0.5 to 4 mm
PCB Weight: 3 kg
Camera: 12 MP
3D Technology: Phase Shift Profilometry’s (PSP) Methodology
Top Clearance: 50 mm
Bottom Clearance: 70 mm
Edge Clearance: 3.5 mm
Conveyor Height: 875 to 965 mm
Net Weight: 900 kg

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MIRTEC - MS-11DL

Solder Paste Inspection Equipment from MIRTEC

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Measurement: Height, Volume / Area, Solder Bridge, X/Y Offset, ...
PCB Size: 50 x 50 to 460 x 590 mm
PCB Weight: 4 kg
Camera: 15 MP
3D Technology: Dual Projection Shadow Free Moiré Phase Step Image...
Bottom Clearance: 50 mm
Edge Clearance: 3 mm
Net Weight: 1030 Kg

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Solder Paste Inspection Equipment

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Dongguan ICT Technology Co.,Ltd - I.C.T-S400D

MIRTEC - MS-15DL

ViTrox Corporation Berhad - V310i Optimus

Dongguan ICT Technology Co.,Ltd - I.C.T-S600

MIRTEC - MS-15U

ViTrox Corporation Berhad - V310i FDL

Dongguan ICT Technology Co.,Ltd - I.C.T-S1200

MIRTEC - MS-11em

ViTrox Corporation Berhad - V310i Standard

MIRTEC - MS-11DL

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