I.C.T-S600

Solder Paste Inspection Equipment by Dongguan ICT Technology Co.,Ltd (6 more products)
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Product Specifications

Product Details

  • Part Number
    I.C.T-S600
  • Manufacturer
    Dongguan ICT Technology Co.,Ltd
  • Description
    SMT 3D spi solder paste inspection machine I.C.T-S600

General Parameters

  • Field of View
    35 mm, 37 mm
  • Measurement
    Paste Height, Paste Area, Paste Volume, Shape Analysis, Bridge Detection, Offset, Contamination
  • PCB Size
    450 x 310 mm Dual
  • PCB Thickness
    0.5 to 5 mm
  • PCB Weight
    ≤ 5 kg
  • Imaging Speed
    0.35 to 0.5 sec/FOV
  • Height Resolution
    0.67µm
  • Camera
    5 MP
  • 3D Technology
    Shadow free, Phase Measurement Profilometry
  • Inspection Type
    3D
  • Max. Solder Height
    0 - 500 um
  • Net Weight
    1300 kg
  • Overall Dimensions
    830 x 1620 x 1470 mm

Technical Documents
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