V310Ai Optimus 3D

The V310i Optimus from ViTrox Corporation Berhad is a 3D Solder Paste Inspection (SPI) Equipment that uses Phase Shift Profilometry’s (PSP) 3D technology. It has a 25 MP CoaXPress industrial camera with an optical resolution of 4.5 μm and a telecentric lens with a FOV of 22.5 x 22.5 mm that achieves an inspection speed of 7-15cm²/sec. This equipment can accommodate PCB boards of sizes ranging from 50 x 50 mm to 470 x 500 mm and a PCB thickness of 0.2 to 4 mm. It can detect missing, XY offset, height, area, volume, bridge and micro bridge defects. This SPI equipment can also perform Leadframe Inspection, Solder Bump Inspection and SiP Inspection. It can also read barcodes using its cameras and also supports a configured external barcode reader.