Circuit Technology Center has added another reflow oven to expand capacity for high-volume BGA reballing, as demand for its PCB repair and component services grows. The new system is already in place and will help the company process more work in less time.The additional Heller 1707MK7 reflow o... Read More
Circuit Technology Center announced it recently received and commissioned a second Heller 1707-MK III in-line solder reflow oven. This new machine doubles the existing in-line reflow oven capacity to meet increasing customer demand for high-volume BGA component re-balling applications. The BGA ... Read More
Circuit Technology Center has announced that it has expanded its Haverhill, Massachusetts facility by over 10,000 square feet. This facility expansion will allow more manufacturing floor space to accommodate additional equipment and personnel supporting circuit board repair/rework, BGA re-balling, a... Read More
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