Latest PCB (Printed Circuit Board) News | Cadence Design Systems, Inc

Cadence Design Systems, announced a broad collaboration with Samsung Foundry that includes technology advancements to accelerate design for AI and 3D-IC semiconductors, including on Samsung Foundry’s most advanced gate-all-around (GAA) nodes. The ongoing collaboration between Cadence and Samsu... Read More

Cadence Design Systems and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics. This collaboration significantly adv... Read More

Cadence Design Systems announced Cadence Celsius Studio, the industry’s first complete AI thermal design and analysis solution for electronic systems. Celsius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs ... Read More

Cadence Design Systems, Inc. announced that it has acquired Invecas, Inc., a leading provider of design engineering, embedded software, and system-level solutions, headquartered in Santa Clara, California. The purchase adds a skilled system design engineering team to Cadence, with expertise in provi... Read More

Cadence Design Systems has revealed a strategic partnership with Broadcom aimed at integrating cutting-edge AI-driven design methodologies for expediting the development of their groundbreaking 3nm and 5nm designs. By leveraging Cadence's AI-driven Cerebrus™ Intelligent Chip Explorer,... Read More

Cadence Design Systems, announced the availability of new system prototyping flows based on the Cadence Integrity 3D-IC Platform that supports the 3Dblox 2.0 standard. The Integrity 3D-IC Platform is fully compliant with the 3Dblox 2.0 standard language extensions, and the flows have been optimized ... Read More

Cadence Design Systems announced it has collaborated with TSMC to integrate the new Cadence Virtuoso Studio into the TSMC N16 mmWave design reference flow and N6RF design reference flow, and added support for the N4PRF design reference flow. With this latest development in Cadence’s and T... Read More

Cadence Design Systems, announced that its digital and custom/analog flows achieved certification for Samsung Foundry’s SF2 and SF3 process technologies. The two companies also worked together to create new process design kits (PDKs) that simplify mobile, automotive, AI, and hyper-scale IC des... Read More

Cadence Design Systems, announced that the AI-based Cadence Virtuoso Studio design tools and solutions have been certified by Samsung Foundry. Joint customers can confidently leverage Virtuoso Studio and Samsung’s mature and advanced node process design kits (PDKs) down to SF2 to advance next-... Read More

Cadence announced it has continued to expand its collaboration with Arm to advance mobile device silicon success, providing customers with a faster path to tapeout through use of Cadence® digital and verification tools and the new Arm® Total Compute Solutions 2023 (TCS23), which includes the... Read More

Cadence Design Systems announced the new Cadence Virtuoso Studio, a next-generation custom design platform that delivers an optimal design experience and ushers in the future for custom analog design. Virtuoso Studio features a reimagined infrastructure with a unique approach to managing design proc... Read More

Cadence Design Systems announced the Cadence Allegro X AI technology, a next-generation system design technology that offers revolutionary improvements in performance and automation. The new AI offering is built on and accessed through the Allegro X Design Platform. It offers transformative time sav... Read More

Cadence Design Systems, announced the leading Cadence® Integrity™ 3D-IC platform has achieved certification for and met all reference design flow criteria for TSMC’s 3DFabric™ offerings, including Integrated Fan-Out (InFO), Chip-on-Wafer-on-Substrate (CoWoS®) and System-on-... Read More

Cadence Design Systems, and Tower Semiconductor, the leading foundry of high-value analog semiconductor solutions, announced a collaboration to advance automotive and mobile IC development. Through the collaboration, the companies are developing a new, comprehensive automotive reference design flow ... Read More