Epec Engineered Technologies

(0 reviews)
  • Manufacturer, Design, Stencil
  • United States, Massachusetts, New Bedford
  • (508) 995-5171
  • 176 Samuel Barnet Boulevard New Bedford, MA 02745
  • Certifications:  ISO 14001, ISO 9001:2008, ITAR

Epec Engineered Technologies is the ideal choice for an OEM seeking customized product solutions from a focused and agile partner having supported over 5,000 customers across all sectors of the electronics industry. By providing highly experienced technical resources, a proven manufacturing platform and the fastest delivery in the industry, we are able to provide cost effective and innovative solutions that deliver the highest reliability products to the market faster.

 

 PCB Fabrication Capabilities

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Layers

Up to 20+ Layers

Board Thickness

.005 to .500

Timeline

Not Specified

Material

Material Brand

PCB Assembly Capabilities

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

Assembly Type

  • Mixed
  • Surface Mount
  • Thru Hole

PCB Sides

  • Single Sided
  • Double Sided
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Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

  • Hand Soldering
  • Leaded Solder
  • Lead-Free (RoHS)
  • Wave Soldering
  • Reflow Soldering
  • Robotic Soldering
  • Selective Soldering
  • Tin-lead Solder

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

Order Type

  • Prototypes
  • Production

PCB Design Capabilities

Design Services

  • PCB Layout and Design
  • Schematic Entry
  • Panel Design for Manufacturing
  • Other

Design Software

  • PROTEL (Altium)
  • PADS Power PCB
  • ORCAD
  • WG
  • Cadence Allegro
  • Eagle
  • Kicad
  • EasyEda
  • PCBWeb Designer
  • ZenitPCB
  • TinyCAD
  • Osmond PCB
  • ExpressPCB
  • gEDA
  • Fritzing
  • Pad2Pad
  • DesignSpark
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PCB Stencil Capabilities

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Epec Engineered Technologies

Stencil Type

PCB Repair / Rework Services

  • Circuitry & Pad Damage Repair
  • BGA Rework
  • Trace repair
  • Component repair
  • Pad & Track Repair
  • Solder Mask Repair
  • BGA Reballing
  • BGA Pad Demage Repair
  • Pad-on-Via Repair
  • Gold Plating Rework
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