AccuTech Provides Precision IR and UV Laser Processing Services for Complex PCB Designs

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AccuTech Laser Processing Inc. has become a trusted partner for advanced PCB laser processing, supporting the fast-paced needs of the electronics industry across the United States. Much of the PCB work performed domestically focuses on quick-turn manufacturing and prototype development, where precision, flexibility, and speed are critical. Laser-based processes—particularly those using IR and UV lasers—are ideally suited to these requirements, and this is where AccuTech consistently delivers value.

With decades of experience and access to multiple laser technologies, AccuTech Laser Processing is widely regarded as a go-to provider for laser cutting, skiving, and other specialized PCB services. The company works closely with customers to solve complex design challenges, offering solutions that are difficult or inefficient to achieve with conventional mechanical methods.

A cross-section of a laser-drilled plated microvia

One of AccuTech’s core capabilities is laser drilling of micro-vias. These vias are typically around 0.006 inches in diameter and pass through thin dielectric layers measuring approximately 0.002 to 0.003 inches. Depending on the application, the top copper layer may be solid or pre-etched to define via diameters and locations. Projects can range from boards with a few hundred vias to highly dense designs featuring more than 100,000 vias per side, all requiring consistent accuracy and repeatability.

Flex circuit singulation or profiling

AccuTech also specializes in PCB de-paneling and flex circuit singulation. Using optically aligned laser systems, the company can precisely route and separate flex circuits by referencing existing patterns. For prototype and low-volume production, laser routing is often the preferred approach, as it significantly reduces fixturing costs while maintaining clean edges and tight tolerances.

Another key service offered by AccuTech is laser skiving, commonly used to expose flying leads beneath polyimide or coverlay materials. This process is also effective for removing excess adhesive squeeze-out from lamination and cleaning up unwanted solder mask on PCBs, resulting in cleaner, more reliable assemblies.

From micro-via drilling to flex circuit profiling and laser skiving, AccuTech Laser Processing Inc. provides a comprehensive range of PCB laser processing services. By combining technical expertise with advanced laser systems, the company continues to support innovative electronics designs with precision, speed, and reliability.

Click here to learn more about PCB laser processing services from AccuTech Laser Processing Inc.