From Multilayer to UHDI: Winonics’ Advanced PCB Manufacturing Capabilities

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Winonics, a subsidiary of Additive Circuits Technologies, offers a complete range of PCB solutions to bring leading-edge applications and new technologies to market. Their PCB solutions include multilayer rigid and rigid-flex PCBs, ultra-fine pitch PCBs, high-density and ultra-high-density interconnects (HDI/UHDI), and PCBs for RF, microwave & millimeter wave applications.

Multilayer Rigid and Rigid-Flex Printed Circuit Boards

Winonics is an industry-leading manufacturer of Multilayer PCBs. Conventional Multilayer PCBs range from 3 to 24 layers, use conventional drilling and plating technologies and are single lamination constructions. Their conventional multilayer PCB capabilities are served by decades of experience from a diverse team of engineers, specialists, experts, and operators.

Capabilities:

• Layer count 24+
• Panel Size up to 21”x24”
• Mixed Materials
• High Aspect Ratio
• Backdrilling
• Edge plating
• RF Microwave
• Cavities, countersunk holes or depth milling
• Heavy copper
• Controlled impedances
• All Surface Finishes

Ultra Fine Pitch PCB

Winonics provides engineering and manufacturing support for Fine Pitch and Ultra-Fine Pitch PCBs used in high-density applications.

Fine Pitch PCBs are characterized by finer pitch features, including narrower conductor widths and spacing that are required for designs using ultra-fine pitch BGAs and higher I/O count components.

Winonics capabilities include traditional dog bone fanouts as well as advanced technology via in-pad construction. Via-in-pad technology enables much tighter routing required for Ultra-Fine Pitch BGA devices.

Capabilities:

• Engineering and Manufacturing support for Ultra-Fine Pitch PCB designs
• Via in pad enabled fanouts
• Conductor widths down to 75µm
• Conductor widths below 50µm utilizing ACT-SAP advanced manufacturing technologies

High-Density and Ultra-High-Density Interconnects (HDI/UHDI)

Winonics supports High Performance, HDI/UHDI solutions for complex advanced technology applications.

HDI/UHDI PCBs are characterized by higher density attributes when compared to conventional PCBs, including laser microvias, sequential lamination construction, finer lines and spacing, and high-performance thin materials.

HDI PCBs take advantage of the latest manufacturing technologies available to enable the use of fine pitch and ultra-fine pitch BGA components that can increase functionality using the same or less surface area, facilitate miniaturization, and improve signal integrity. This advancement in PCB technology supports advanced features in groundbreaking new products, including 5G communications, networking equipment, medical patient monitoring, autonomous applications, remote sensing systems, vehicle-to-everything communications, and military applications such as satellites, avionics, and intelligent munitions.

Capabilities:

• Sequential laminations
• Stacked and staggered microvias
• Blind and Buried microvias
• Copper-filled microvias
• Minimum conductor widths and spacing
• Advanced technology materials
• Cavities, countersunk holes, or depth milling
• Controlled impedances

RF, Microwave, Millimeter Wave

Winonics provides innovative engineering solutions and advanced process capabilities for RF, Microwave, and mmWave PCBs with frequency bands to support applications from defense, space, and aerospace electronics, complex telecommunications equipment, to 5G enablement, and mmWave automotive radar.

Our Engineering and Manufacturing teams have extensive experience with a wide range of low-loss and high-speed laminate materials to ensure that your designs meet DFM/DFX standards for quality, performance, and reliability in the field.

Capabilities:

• Tight tolerances for critical RF features
• Uniform copper build-up
• Mechanical Backdrilling
• High-performance materials, including Rogers, Taconic, Panasonic, and Isola
• IPC class 2, IPC class 3
• AOI, Flying Probe, Differential Impedance, & TDR testing

Additive Technologies, ACT-SAP

Winonics and its parent company, Additive Circuits Technologies, LLC, are jointly developing commercial applications for Fully Additive and Semi-Additive Process (ACT-SAP) manufacturing technologies in their Advanced Research and Development Center located in the Winonics facility in Brea, CA. The department is staffed with a highly specialized team of engineers and technicians that has set its sole focus on furthering ACT’s pioneering technologies for manufacturing next-generation printed circuit boards and microelectronics.

Click here to learn more about Winonics and its advanced PCB capabilities.