Arnold Electronics Provides Prototyping and Manufacturing Services for HDI PCBs

Arnold Electronics Provides Prototyping and Manufacturing Services for HDI PCBs712370

Arnold Electronics provides a complete range of services to its customers in PCB prototypes and PCB manufacturing for HDI PCBs.

Arnold Electronics Provides Prototyping and Manufacturing Services for HDI PCBs

Contact Arnold Electronics, Inc. to learn more.

High-Density Interconnects (HDI) are utilized to meet the market demand for complex designs in smaller form factors across the majority of market segments, including Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation. HDIs overcome the limitations found in standard circuit technologies through the utilization of ultra-thin cores, fine line processing, and alternative via methods to reduce the size and weight of your components.

HDI PCBs have higher interconnect density per unit area, requiring more sophisticated technology and manufacturing processes for their production. HDI PCBs are boards with high-density characteristics, including micro-sized holes, fine lines, and can be constructed with thin high-performance materials, thereby enabling more interconnection functions per unit area.

Types of HDI Structures

  • 1+N+1 – PCBs contain 1 “build-up” of high-density interconnection layers.
  • i+N+i (i≥2) – PCBs contain 2 or more “build-up” of high-density interconnection layers. Microvias on different layers can be staggered or stacked. Copper-filled stacked microvia structures are commonly seen in demanding designs.
  • Any Layer HDI – All the layers of a PCB are high-density interconnection layers, which allow the conductors on any layer of the PCB to be freely interconnected with copper-filled stacked microvia structures. This provides a reliable interconnect solution for highly complex, large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.

Advanced HDI Capabilities of Arnold Electronics:

  • Any layer HDI
  • Multilayer copper-filled stacked micro via structure
  • 1.2/1.2 mil line/space
  • 3/9 mil laser via capture pad size
  • Embedded, distributed, and discrete passive components
  • Complex rigid-flex HDI products
  • Wide material and surface finish selections

Click here to learn more about the services provided by Arnold Electronics for HDI PCBs.

Arnold Electronics Provides Prototyping and Manufacturing Services for HDI PCBs

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