Aspocomp Designs and Manufactures PCBs With Component Cooling Features for Thermal Management

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Aspocomp provides a wide variety of PCBs with a designed-in cooling feature for high-power components. They allow customers to choose a tailored solution right under the component that leads to heat flow efficiently through the PCB. Aspocomp provides the following PCB cooling technologies:

• Via farm cooling by filled+capped vias / IPC Type VII / POFV (provided by Aspocomp since 2003)
• Pre-bonded metalback (since 2002)
• Post-bonded metalback (since 2002)
• Embedded T-coin (since 2012): Thermal paths with the T coin have only 50% of the thermal resistance compared to a similar-sized viafarm
• Embedded I-coin (since 2012)
• Embedded C-coin (since 2012): Embedded coin technology enables the insertion of a piece of solid copper right under the component.

Each solution has a different thermal resistance and cost background.

At Aspocomp, a PCB designer’s loop for thermal design and optimization is a structured, iterative process aimed at achieving reliable thermal performance. It begins with thermal simulation and design, where potential heat issues are identified and addressed early. The design is then realized through PCB manufacturing and PCB assembly, followed by thermal measurements and/or thermal imaging to capture real-world performance data. These results are carefully analyzed and compared against a thermal benchmark, providing valuable feedback that feeds into the next design iteration and continuously improves thermal efficiency and reliability.

Click here to learn more about Aspocomp's component cooling solutions for PCB thermal management.