AT&S Advances PCB Miniaturization with mSAP Manufacturing Technology

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AT&S is advancing the limits of printed circuit board manufacturing through its use of mSAP (Modified Semi-Additive Process), a technology that enables PCB and IC substrate designs approaching the scale and complexity of semiconductor products.

Unlike conventional subtractive PCB processes, where signal traces are etched out of a continuous copper layer, mSAP applies copper only where it is functionally required. This targeted deposition allows for significantly finer line widths and smaller spacing between conducting paths, supporting the growing demand for high-density interconnects in advanced electronics.

By adopting mSAP, AT&S can integrate a greater number of extremely small structures onto a single PCB. The process enables precise placement of copper traces, allowing them to be positioned closer together without compromising reliability. As a result, mSAP supports higher circuit density while maintaining signal integrity, even in increasingly compact designs.

Enabling the Next Level of Miniaturization

mSAP represents a major step forward in microelectronic miniaturization. Its ability to realize circuits in exceptionally confined spaces makes it particularly well-suited for today’s thin, lightweight devices, such as smartphones and wearables. Compared to traditional chemically etched traces, mSAP conductors do not require triangular cross sections, which reduces the risk of short circuits and minimizes electromagnetic interference on densely populated boards.

The technology also offers clear advantages for high-frequency applications. Shorter signal paths and tightly controlled geometries help reduce signal loss, making mSAP an effective solution for components used in next-generation mobile networks and other high-speed data environments.

Benefits of mSAP:

• mSAP saves space as it allows denser conducting path layouts. This opens the way for the miniaturization of PCBs and devices.
• Short signal paths enhance signal transmission on the PCB.
• mSAP offers better performance at a smaller size.
• Radically thin PCBs for radically thin devices.
• mSAP shrinks PCBs, freeing up space for sensors, cameras, and larger batteries.

Recent applications demonstrate the value of this approach. In modern smartphone camera modules, for example, highly compact mSAP-based PCBs have enabled the integration of multiple cameras within a single microelectronic system—an achievement that would be difficult to realize using conventional PCB processes.

Applications of mSAP:

• mSAP enables very thin devices without compromising on performance.
• If there is little available space, mSAP ensures that the needed electronics will still fit.
• Complex applications like advanced driver assistance systems require powerful electronics. mSAP allows for more powerful circuits without the need for more space.
• mSAP can prove a cost-effective alternative for LED displays.
• The demand for high-speed transmission in data infrastructure is growing, and mSAP can help to achieve 400G/800G or higher speeds within the existing form factor.

Beyond size and performance, mSAP contributes to improved energy efficiency. By supporting compact layouts and efficient signal transmission, the technology helps lower overall power consumption, a critical factor for battery-powered devices.

Through mSAP, AT&S continues to expand the capabilities of PCB manufacturing, supporting the electronics industry’s ongoing push toward smaller, faster, and more energy-efficient systems.

Click here to learn more about mSAP technology from AT&S.