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AT&S takes printed circuit board design to the next level with its innovative 2.5D® cavity PCB technology, enabling more compact, flexible, and high-performance electronic systems.
AT&S’s 2.5D® Technology Allows Creation of Cavity PCBs that are Extremely Miniaturized and Thin
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Redefining PCB Design with 2.5D® Technology
The 2.5D® cavity printed circuit boards from AT&S introduce a new way of utilizing space within multilayer PCBs. By creating precisely defined recesses (or cavities) within individual PCB layers, components can be positioned lower inside the board rather than mounted only on the surface. This approach significantly reduces overall board thickness while enabling highly compact designs.
Beyond miniaturization, selectively removing material from inner layers allows PCBs to become semi-flexible. These boards can be bent during installation, opening up new possibilities for space-constrained applications and unconventional form factors. As a result, 2.5D® technology supports next-generation designs in areas such as SSD storage devices, advanced driver assistance systems (ADAS), laser sensors, and compact consumer electronics.
Compact, Flexible, and Cost-Effective
One of the key advantages of 2.5D® cavity PCBs is design flexibility. Cavities can be customized in depth, shape, and position to match the specific requirements of each component. This allows designers to maximize the usable volume of the PCB while keeping systems thin and lightweight.
Compared with alternative miniaturization techniques, 2.5D® offers a cost-effective solution. It uses standard PCB materials and requires relatively few additional process steps. Placing components inside cavities can also be more efficient than surface mounting or fully embedding components, reducing manufacturing complexity.
Optimized Performance and Thermal Management
Strategically placed cavities do more than save space; they can also enhance key PCB properties. By adjusting cavity placement and geometry, designers can improve heat dissipation, optimize radio-frequency performance for wireless communication, and better manage signal integrity. Cavities can even be metallized to provide shielding against electromagnetic interference, further improving system reliability.
In high-performance applications such as driver assistance systems, where processing power, thermal control, and compact size are critical, 2.5D® cavity PCBs help deliver optimal performance without compromising on space.
Semi-Flexible PCBs for Tight Installations
AT&S’s 2.5D® technology also enables the production of semi-flexible PCBs. By removing substantial material from inner layers, the mechanical properties of the board change, allowing it to bend up to 90 or even 180 degrees during installation. This flexibility makes it easier to fit electronics into tight or irregular spaces while maintaining fast, reliable electrical connections.
Such semi-flexible designs are particularly valuable in automotive electronics, camera modules, and compact storage devices, where durability and high integration are essential.
Making the Most of Every Millimeter
With 2.5D® cavity printed circuit boards, AT&S enables designers to exploit the available PCB volume fully. Whether it’s increasing memory density in SSDs, reducing space requirements in automotive systems, or enabling innovative foldable designs, 2.5D® technology delivers a powerful combination of miniaturization, flexibility, and cost efficiency.
By pushing the boundaries of conventional PCB design, AT&S’s 2.5D® technology is helping engineers create thinner, smarter, and more adaptable electronic systems for today’s most demanding applications.
Click here to learn more about 2.5D® cavity PCBs from AT&S.
