Bench 2 Bench Technolgies Delivers Micron-Scale Precision in UHDI Flexible Circuits

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Bench 2 Bench Technologies operates with a focused premise: ultra-high-density interconnect (UHDI) flexible circuits demand specialized engineering, precise handling, and close technical collaboration. The company’s approach emphasizes understanding application requirements early, enabling informed recommendations on materials, finishes, and manufacturing processes tailored to each design.

Its core strength lies in the production of ultra-thin, fine-feature flexible circuits, where dimensions are measured in microns rather than traditionally used millimeters. These fine geometries allow higher functional density and increased usable circuit real estate, supporting compact, lightweight, and performance-driven electronic systems.

Bench 2 Bench supports a broad range of material sets and finishes, including copper, tin, lead, gold, nickel, and OSP. Manufacturing services extend beyond fabrication to include value-added processes such as stiffener integration, RFI shielding, and lead-free solder solutions for RoHS-compliant programs. The company works extensively with adhesiveless polyimide base materials to achieve precise thickness control and improved electrical and mechanical performance.

Founded in Fullerton, California, in 1967, the facility adopted the Bench 2 Bench name in 2008 under JR Controls. In September 2021, the company was acquired by Additive Circuits Technologies (ACT). This integration expanded Bench 2 Bench’s capabilities through ACT’s proprietary additive manufacturing technologies, strengthening its position in the UHDI flexible circuit market. The combined technology platform supports the development of smaller, faster, and thinner circuits while enabling more scalable and industrialized production of high-definition flex designs.

Bench 2 Bench now operates alongside ACT and Winonics, a rigid PCB manufacturer serving aerospace and avionics markets. Together, the organizations span multiple circuit technologies, expanding manufacturing capacity and technical coverage across flexible and rigid interconnect solutions.

Key Capabilities Include:

• Fine line imaging
• Microvia formation
• Adhesiveless polyimide flex base materials
• Multiple metal layer configurations
• LPI soldermask processing
• Controlled coverlay and adhesive thicknesses
• UV and CO2 laser processing
• Surface plating and finish options
• Value-added processing services

Through its specialization in UHDI flex circuits and integration within ACT’s broader technology portfolio, Bench 2 Bench Technologies continues to support demanding electronic applications that require precision, density, and reliability.

Click here to learn more about Bench 2 Bench Technologies' capabilities for UHDI flexible circuits.