Benchmark Provides Expertise in Rapid Development and Production of Mixed and Hybrid Systems

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Benchmark Electronics Inc.'s facility is designed for the rapid development and production of mixed and hybrid systems. Mixed technology modules are a key tool for achieving SWaP goals in high-reliability systems. Benchmark makes bringing these designs to reality easy and efficient by combining highly capable microelectronics and Surface Mount Technology (SMT) assembly in one location.

Benchmark’s Capabilities for Mixed and Hybrid Systems include:

• Automated SMT and microelectronic assembly for repeatable, precise assembly up to mmWave frequencies
• Automated RF testing of all products available; custom testing according to mechanical and electrical requirements
• Assembly with leaded or lead-free (RoHS-compliant) solder processes and components
• Precision die-bonding with several methods, including conductive adhesive, gold-tin eutectic, and gold ultrasonic attachment
• Manual or automated ball and wedge wire bonding, ribbon bonding, and encapsulation
• 3D x-ray analysis, laser, and ultrasonic microscopes, and electrical testing past 110 GHz

Advantages of Choosing Benchmark

• Precision micro-e solutions can combine technologies: analog, digital, RF, and mmWave
• Electronic circuits and assemblies built to meet or exceed SWaP requirements.
• Fast turnaround from design to full-scale production, improving time to market

Click here to learn more about Benchmark’s expertise in mixed and hybrid systems.