Calumet Electronics Advances its HDI and HBDU Manufacturing Capability

Calumet Electronics Advances its HDI and HBDU Manufacturing Capability712370

Calumet Electronics has built one of America’s most advanced high-density interconnect (HDI) and High Density Buildup (HBDU) factories. Significant capital investments in equipment were made and brought online for the HDI capacity to be operational through 2025. New equipment began arriving at Calumet in September 2024 and Q1 and Q2 of 2025.

Calumet Electronics Advances its HDI and HBDU Manufacturing Capability

Contact Calumet Electronics to learn more.

As one of America’s most reliable and innovative printed circuit board and substrate suppliers, Calumet Electronics is committed to advancing technologies that are critical to the nation’s aerospace, defense, and commercial markets. With growing demand for miniaturization and increased functionality, this equipment allows Calumet to offer a more compact design with high reliability, better signal integrity, and greater versatility, especially when weight and space are key considerations.

By accelerating domestic HDI and HBDU manufacturing technology, Calumet boosts production of more advanced products with greater precision. Calumet’s solely U.S.-based production is available to support national security, intellectual property protection, and reduce the chance of supply chain delays.

New, high-performance HDI equipment advanced Calumet Electronics' capabilities in the following ways:

  • Precision etching that improves consistency, accuracy, and yield for fine feature designs on both sides of the panel
  • Improved developing consistency for fine lines and spaces, which allows for increased design density
  • Better metallization capacity with direct impingement for higher aspect ratio designs
  • All-digital processing to improve capacity for high-resolution solder mask
  • Trace repair to increase yields on increasingly dense features. High-speed, high-throughput drilling of sub-8 mil drills, automated to decrease handling damage
  • High-accuracy, high-speed optical routing to increase capacity for routing throughput
  • Automated microsection prep to increase capacity for inspection and measurement of HDI features
  • Improved hole wall preparation for metallization of high aspect ratio and small size drills

Click here to learn more about Calumet Electronics’ HDI and HDBU manufacturing capabilities.

Calumet Electronics Advances its HDI and HBDU Manufacturing Capability

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