CCI Specializes in PCB Blind and Buried Vias for Miniaturization and Integration of Electronic Products

https://cdn.pcbdirectory.com/news/CCI_wide_638986160950872675.jpg712370

Canadian Circuits Inc. (CCI) specializes in blind vias and buried vias in advanced PCBs. They provide rapid prototyping for PCBs, where the design requires manufacturing either of the two vias.

Blind and buried vias are used to connect between layers of an HDI PCB with 4 layers or higher to meet the density constraints of lines and pads without increasing the number of layers or the size of the board. A blind via connects an outer layer to one or more inner layers but does not go all the way through the top and bottom layers. A buried via connects two or more inner layers but can not be seen from the top or bottom layers.

TMP Vacuum Press with Heat and Cool Cycle

While adding blind buried vias to the boards, some of the fabrication aspect needs to be considered to reduce fabrication complexity and the cost. The process of making blind and buried via may involve several thermal press cycles (also called Sequential Lamination). The number of press cycles should be reduced to decrease the cost and increase the quality and reliability of the boards. Hence, Blind and buried vias add cost to the board, and therefore, the designer needs to consider where it is necessary to add blind buried vias or increase the layer counts.

Click here to learn more about blind via and buried PCBs from CCI.