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Cirexx, a U.S.-based manufacturer specializing in flexible and rigid-flex printed circuit boards, offering design, fabrication, and assembly services, provides copper and epoxy filled vias as part of its PCB design, fabrication, and assembly services, supporting applications that require compact layouts, thermal management, and reliable interconnections.
Cirexx Offers Copper and Epoxy Filled Via Solutions for PCB Manufacturing
Contact Cirexx International Inc to learn more.
The company integrates filled vias into PCB manufacturing, either plated with copper or filled with epoxy, for designs involving micro-BGAs and other compact components. Its services cover the full process from layout through production.
Cirexx manufactures copper filled microvias that are filled with copper to enhance PCB functionality. These vias support cooling by helping dissipate heat and connectivity by bridging connections between different board layers. The company produces these vias through laser drilling, metallization with an electroless copper seed layer, imaging, and specialized electroplating. This process requires precision and can result in higher manufacturing costs. Copper filled microvias also allow fanning out of traces to inner layers for high-density components such as BGAs and help channel heat to plane layers and toward the board edge.
The company also provides epoxy filled vias, including thru-holes filled with non-conductive or conductive epoxy resin. These vias support component placement directly over the via and provide a flat board surface required for certain components. In the case of conductive epoxy resin, they can channel heat from components such as sensors or GaN amplifiers, although epoxy does not conduct heat as efficiently as copper or conductive via fill. The company’s process includes plating the hole, filling it with epoxy, and sealing it with copper, often referred to as a cap layer.
Both copper and epoxy filled via technologies to enhance PCB functionality and design by connecting different parts of a board. Copper filled vias are used for heat dissipation and high-density routing, while epoxy filled vias are used where flat surfaces and space-saving designs are required.
Cirexx supports applications across telecommunications for signal transmission, aerospace for operation in demanding environments, medical devices for complex designs, automotive electronics for system performance, consumer electronics for compact devices, industrial electronics for robust operation, and energy applications requiring complex circuitry.
Adding filled vias increases PCB production time depending on design complexity, with each addition extending production by approximately three days. With over 40 years of experience, Cirexx provides copper and epoxy filled via integration as part of its PCB manufacturing services for a range of industry requirements.
Click here to learn more about the Cirexx's copper and epoxy filled via technologies.
