Cirexx Offers HDI PCB Fabrication & Manufacturing Services Using Advanced Production Equipment

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Cirexx provides high-density interconnect (HDI) PCB fabrication and manufacturing services, addressing the growing demand for compact, high-performance circuit boards across industries such as medical, aerospace, defense, and consumer electronics. HDI technology is now widely used in smartphones, tablets, and other space-constrained digital devices where signal integrity, reliability, and miniaturization are critical.

HDI PCBs are characterized by thin lines, closer spaces, and more dense wiring, which allow for a faster connection while reducing the size and bulk of a project. These boards also feature blind and buried vias, laser-drilled microvias, sequential lamination, and via in-pads.

Operating from its Silicon Valley facility, Cirexx supports HDI designs that require fine lines, tight spacing, and high wiring density. Its manufacturing capabilities include blind and buried vias, laser-drilled microvias, sequential lamination, and via-in-pad structures. To meet tight tolerances, the company uses advanced processes such as laser direct imaging (LDI) and controlled depth drilling and milling. CIrexx regularly invests in sophisticated production equipment, which includes LDI equipment. In addition, they currently have four dual-headed lasers for via forming of blind and buried vias, laser-ablated pockets, and precision routing of flex circuits.

HDI processes offered:

• Back drilling – A method of disconnecting part of the plated through hole from other layers inside.
• Controlled depth drilling/milling
• Buried capacitance – This technology can increase the performance of printed circuit boards through improved signal integrity. This process incorporates a very thin dielectric layer that provides distributive decoupling capacitance.
• Hole tolerances – With their advanced technology drilling equipment, Cirexx is able to hold very tight hole tolerances and hole locations. This is important because these holes have multiple functions, including through-hole connector insulation and preventing signal leakage.
• Fine pitch – Down to 0.3mm

A key differentiator is the company’s in-house manufacturing model. Fabrication, engineering, testing, and assembly are handled under one roof, allowing greater control over quality and lead times. Cirexx operates four dual-headed laser systems for microvia formation, laser-ablated pockets, and precision flex circuit routing - an unusually high concentration of laser capability for a North American PCB manufacturer.

Engineering support is integrated throughout the process, with teams experienced in a wide range of PCB materials and HDI stackups. This allows early design-for-manufacturability input and clearer visibility into cost drivers for complex builds.

For time-critical projects, Cirexx offers quick-turn HDI PCB fabrication, with lead times ranging from 1-5 days and, in select cases, as little as 24 hours. All quick-turn builds are completed without outsourcing, maintaining full control over process quality and schedules.

Cirexx supports regulated and high-reliability markets through certifications including AS9100, ISO 9001, J-STD-001 ES, ITAR compliance, and multiple MIL-PRF standards, enabling production of Class 3 and Class 3DS boards for aerospace and defense applications.

With continued investment in HDI and LDI technologies, Cirexx positions its HDI PCB fabrication and manufacturing services as a practical option for companies developing advanced, space-constrained electronic products under demanding timelines.

Click here to learn more about HDI PCB capabilities from Cirexx.