COFAN USA’s Patented Super Pillar™ Technology Delivers for Superior PCB Thermal Management

COFAN USA’s Patented Super Pillar™ Technology Delivers for Superior PCB Thermal Management712370

COFAN USA has developed patented Super Pillar™ Technology, a breakthrough in thermal management that delivers superior heat dissipation compared to conventional MCPCBs (Metal Core Printed Circuit Boards). By bypassing the dielectric pre-preg layer, Super Pillar™ creates a direct thermal path from the t-pad metal to the pillar metal, achieving more than 100x better thermal conductivity than standard MCPCB designs.

COFAN USA’s Patented Super Pillar™ Technology Delivers for Superior PCB Thermal Management

Contact COFAN USA to learn more.

Why Super Pillar™ Outperforms Conventional MCPCBs

Traditional MCPCBs rely on insulating pre-preg layers that restrict heat transfer. In contrast, Super Pillar™ eliminates this bottleneck by using a direct copper or aluminum pillar connection, drastically reducing thermal resistance.

  • Higher Heat Dissipation: Maintains lower junction temperatures under high power.
  • Improved LED Performance: Higher light output per watt and better reliability.
  • Longer Product Lifespan: Reduced thermal stress ensures extended durability.
  • Cost Efficiency: Aluminum pillars provide a budget-friendly option, while copper pillars deliver maximum thermal performance.

Key Benefits of Super Pillar™ Technology

  • Direct Thermal Conductive Path: Minimizes junction temperature rise.
  • Energy Efficiency: Enables higher currents while conserving power.
  • Enhanced Optical Output: Less thermal decay results in brighter, more efficient LEDs.
  • Scalability: Customizable with copper (maximum performance) or aluminum (cost-effective solution).
  • Components that withstand high power output/LEDs/UVC
  • Utilizes lower-cost pre-preg

The Super Pillar™ MCPCB redefines thermal management by bypassing the pre-preg layer and creating a direct, ultra-efficient thermal conduction path. This innovation allows designers to push the limits of LED performance, achieve higher optical efficiency, extend product lifespan, and significantly reduce thermal decay.

Super Pillar™ Technology provides the thermal management solution needed when designing next-generation LED systems or high-power electronics. These pillars improve heat dissipation, electrical conductivity, and mechanical stability, making them ideal for applications requiring high power efficiency and thermal management like automotive, theatre lighting, medical, military, UV lighting and street lighting.


Click here to learn more about Super Pillar™ from COFAN USA.

COFAN USA’s Patented Super Pillar™ Technology Delivers for Superior PCB Thermal Management

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