Elephantech Scales Flexible Printed Circuits Capabilities with Ultra-Thin & Thick Copper Foil Innovations

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Elephantech has expanded its proprietary SustainaCircuits™ printed circuit board lineup with the introduction of new flexible printed circuits (FPCs), now in mass production. The expanded portfolio includes copper foil thicknesses of less than 1 μm and over 100 μm. It significantly broadens design flexibility for automotive power electronics, industrial equipment, battery systems, and harness replacement applications.

By integrating its proprietary inkjet printing and electroplating technologies, Elephantech continues to reduce copper consumption by 70 - 80% compared to conventional subtractive manufacturing methods. This additive manufacturing approach deposits copper only where required, minimizing material waste and delivering substantial environmental and cost benefits - particularly in thick copper-foil configurations.

Advancing Sustainable Circuit Board Manufacturing

Since 2020, Elephantech has leveraged precision inkjet technology to mass-produce SustainaCircuits™, establishing a production model centered on material efficiency and reduced environmental impact. Previously offering FPCs with copper foil thicknesses between 3 μm and 12 μm, the company has now expanded its capabilities to address evolving performance and customization requirements across multiple industries.

Material Innovation: Newly Developed Primer for Precision and Adhesion

A newly developed primer technology enables both high-resolution inkjet printing of fine copper patterns and improved adhesion performance. This advancement establishes a new benchmark in pattern fidelity and mechanical reliability. The enhanced adhesion system supports thinner 12.5 μm polyimide substrates, in addition to standard 25 μm substrates, contributing to reduced overall FPC thickness and improved flexibility. These configurations are currently available for development applications.

(Left: Existing material, Right: New material -The new primer physically anchors copper nanoparticles into the surface layer, significantly improving adhesion.)

Process Optimization: Thick Copper for High-Current Transmission

For thick copper-foil FPCs, Elephantech has optimized its proprietary electroplating process, enabling compatibility with both flexible and rigid multilayer circuit board architectures. This enhancement allows the company to support a wide range of copper thickness requirements:

• Standard market thicknesses: 18 μm and 35 μm
• Newly available options: Above 35 μm
• Current mass production: Up to 100 μm
• Development capability: Up to 200 μm

Thick copper configurations are engineered to meet high-current transmission demands, particularly in power electronics applications. Because SustainaCircuits™ uses an additive deposition approach rather than etching away excess copper, cost advantages increase as copper thickness rises, while material waste is significantly reduced.

Sustainable Manufacturing for Next-Generation Electronics

The expanded copper thickness range has already generated demand for replacing conventional double-sided FPCs, with multiple mass production projects underway across various applications. With the introduction of sub-1 μm and 100 μm+ copper foil options, Elephantech further strengthens SustainaCircuits™ as a scalable, environmentally responsible solution for flexible electronics manufacturing. Through continued innovation in materials and additive processing technologies, the company aims to support high-performance applications while contributing to long-term sustainability and reduced carbon impact across the electronics industry.

Click here to learn more about flexible PCBs from Elephantech.