KSG Offers Iceberg® PCB Solutions with High Current Handling and Heat Dissipation Capabilities

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KSG offers Iceberg® PCB solutions specifically developed to handle high currents and increased heat dissipation in today’s increasingly powerful electronic systems. By using thick copper structures with mixed copper thicknesses ranging from 105 to 400 µm in the outer layers and maintaining a uniform surface topography, KSG enables the efficient combination of high current paths and fine conductors within multilayer designs. This makes Iceberg® PCBs an ideal solution for applications requiring both reliable current-carrying capacity and effective thermal management.

General Customization Options Offered for Iceberg® PCBs

KSG can customize Iceberg® PCBs to meet specific customer requirements across a wide range of technical parameters. Designs are available with 2 to 8 layers, using thermostable FR4 material and overall PCB thicknesses from 1.5 mm to 3.2 mm. Depending on the application, inner layer copper thicknesses can be selected from 18, 35, 70, 105, or 210 µm, while outer layers are realized with thick copper of 105 or 400 µm. Manufacturing constraints such as a minimum drill diameter of at least two-thirds of the total copper thickness and an aspect ratio of ≤ 1:6 are taken into account to ensure reliable production. This flexibility allows KSG to tailor Iceberg® PCBs precisely to electrical, thermal, and mechanical demands.

Specific Surface Options

To suit different assembly, reliability, and application requirements, KSG Iceberg® PCBs are available with a range of surface finishes. Standard options include electroless nickel/gold, electroplated nickel/gold, immersion tin, and OSP, with additional surface finishes available upon request to meet specific customer or application needs.

Body Variants

Microvias (Lasered) on Outer Layers

Microvias (lasered) in combination with plated-through laminates (mechanically drilled)

Microvias (lasered) in combination with buried vias (mechanically drilled)

Staggered microvias (lasered) in combination with buried vias (mechanically drilled) - from L2 to Ln-1

Staggered microvias (lasered) in combination with buried vias (mechanically drilled) - from L3 to Ln-2

Stacked microvias (lasered) with microvia copper filling in combination with buried vias (mechanically drilled)

Double Core

Key Advantages of Iceberg® PCBs

• Optimized parts and logistics management 
• Production and processing with common copper-based materials in standard processes 
• Cost optimization of the end product 
• Use of standard materials/technologies 
• High currents and heat spread in the circuit board

Click here to learn more about Iceberg PCBs from KSG GmbH.