KSG Provides HSMtec PCB Technology for High-Current and Thermal Management Applications

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KSG, a provider of printed circuit boards specializing in high-current and thermal management technologies, provides HSMtec® PCB technology that integrates copper elements into printed circuit boards to combine high-current paths, thermal management, and fine conductor layouts within a single PCB.

With HSMtec® PCBs, KSG integrates copper profiles partially into the PCB, allowing targeted routing of high currents and heat loss. The technology supports high-current paths of 400 amps and more and enables thermal management of power components such as MOSFETs and IGBTs. It also supports reductions in system costs related to logistics, procurement, production, and quality assurance, while enabling standard production processes and improving efficiency and service life of components. The approach increases reliability by replacing plug and cable connections, busbars, and similar elements, while reducing space, weight, and volume. Notch milling enables three-dimensional, self-supporting PCB elements.

KSG positions this technology for applications where control and power electronics are combined. By integrating copper profiles into the PCB, high-current paths and thermal management can be adapted to spatial requirements, enabling routing of heat and current without additional external processing steps.

In the manufacturing process, KSG embeds copper profiles directly into the PCB and bonds them to etched inner and/or outer layers using ultrasonic bonding technology. This allows integration into standard multilayer production with subsequent pressing of layers. Copper elements with widths from 2 to 12 mm and variable lengths provide flexibility for high-current layouts and thermal design, including performance improvements in existing PCB designs.

KSG compares HSMtec® with other PCB technologies such as thick copper and Iceberg® structures, outlining differences in current handling, heat distribution, design flexibility, and 3D capability.

The range of services includes FR4 materials, PCB thicknesses from 0.8 mm to 3.2 mm, and layer counts from 2 to 10. Copper thickness ranges from 35 to 105 µm, with lamination thickness between 2 and 4 oz and plating thickness of at least 2.5 mils in holes. The smallest drill diameter is 0.25 mm, or 0.50 mm through copper profiles, with an aspect ratio of up to 1:8. Solder resist options include photosensitive and non-photosensitive systems with various color options, along with additional features such as labeling, hole filling, peelable lacquer, heatsinks, and carbon. 

Edge metallization is available to improve EMC protection and electrical contact, and contour processing includes milling and scoring. Milled vias enable components to be soldered onto another circuit board as interposers. Surface finishes include electroless nickel/gold, immersion tin, electroplated nickel/gold, and OSP.

KSG supports high-current management up to 400 amps by integrating large copper cross-sections into multilayer PCBs. This enables the combination of high-current and fine conductor structures within the same layer. Copper profiles are embedded and bonded using ultrasonic technology, allowing production within standard processes and customization for different PCB designs.

High-current connections integrated into the PCB eliminate the need for external components such as busbars, plugs, and cables. This contributes to increased reliability, reduced space requirements, and improved EMC behavior.

For semiflex PCB structures, KSG includes variants such as asymmetrical designs with one or two copper layers in the flex area using depth milling, as well as structures using semiflexible base materials.

For heat management, KSG integrates solid copper elements to enable rapid heat dissipation from components such as MOSFETs, IGBTs, and LEDs. The approach provides low thermal resistance through direct contacting using microvias, supports optional insulation resistance above 4 kV, and enables combined high-current and thermal management within a single board. It also supports optimized service life and efficiency while reducing overall system costs by integrating control and power electronics into one PCB.

HSMtec® PCBs support 3D functionality, allowing PCB segments to be bent up to 90 degrees. Integrated copper profiles at bending points provide mechanical stability and enable electrical and thermal connections between segments, reducing failure risks while supporting compact designs.

KSG also presents an online seminar under its XPERTS series covering cost-efficient 3D printed circuit boards. The session provides an overview of 3D PCB possibilities, discusses project requirements and suitable technologies, and addresses total cost considerations.

Click here to learn more about the KSG's HSMtec PCB technology.