Meiko Designs and Manufactures Advanced Semiconductor Package Substrates

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Meiko Electronics, a Japanese company that is involved in the design, manufacturing, and sales of PCBs and other electronic-related businesses, has semiconductor package substrate manufacturing capabilities that strengthen its position as a key player in the global semiconductor supply chain. These substrates, essential for mounting semiconductor IC chips onto printed circuit boards, serve as critical external connection terminals in a wide range of electronic devices.

To meet the increasing demand for ultra-miniaturized and high-performance components, Meiko has implemented cutting-edge manufacturing methods such as the Modified Semi-Additive Process (MSAP) and Semi-Additive Process (SAP). These advanced techniques enable the formation of ultra-fine circuit patterns with line/space (L/S) dimensions as small as 10/10 μm.

The company’s production systems are also compatible with special ABF (Ajinomoto Build-up Film) materials, allowing greater flexibility in design and material selection. Additionally, Meiko has introduced coreless substrate technology to support the development of thinner and lighter semiconductor packages — a growing necessity in next-generation electronic devices.

With a proven track record in semiconductor memory and CPU applications, Meiko continues to expand both its manufacturing capacity and R&D initiatives domestically and internationally. These efforts are aimed at meeting the evolving requirements of industries such as automotive, IoT, AI, computing, and communication modules.

Through continuous innovation and investment, Meiko reaffirms its commitment to advancing semiconductor packaging technology and delivering high-performance, reliable solutions for the rapidly evolving electronics market.

Click here to learn more about Meiko's Advanced Semiconductor Package Substrates.