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NetVia Group, a provider of printed circuit board (PCB) manufacturing and advanced fabrication services for electronics applications, provides wrap plating capabilities for printed circuit boards (PCBs), referencing IPC Standard IPC-6012B Amendment 1, which defines performance and quality requirements for rigid PCBs, including guidelines for wrap plating.
NetVia Group Provides Wrap Plating for PCBs Compliant with IPC Standard IPC-6012B Amendment 1
Contact NetVia Group, LLC to learn more.
Wrap plating is used in rigid PCB manufacturing, particularly in applications requiring high reliability. The process involves plating copper on through-hole walls that extend over the top and bottom edges of the board to create electrical connections between layers. IPC-6012B specifies requirements, testing, and performance criteria for this process.
The standard defines key requirements for wrap plating, including copper thickness of approximately 0.0008 inches (20 microns), full coverage of through-hole edges and extension onto outer layers, and proper adhesion to prevent peeling or delamination. It also includes requirements for uniform plating thickness, defined defect criteria such as voids or cracks, and testing for adhesion, continuity, and overall quality.
NetVia Group details its wrap plating capabilities, including copper wrap plating structures used in via-in-pad designs for multilayer PCBs. These structures connect plated vias to pads and traces, supporting signal routing between layers. IPC-6012E introduces a requirement for copper wrap plating in via-in-pad structures, where plating extends around the via edge and onto the annular ring to improve reliability and reduce failures caused by cracks or separation.
The company also includes high-precision plating processes to achieve uniform thickness and coverage, supporting applications such as high-density interconnect (HDI) boards.
The wrap plating process includes panel plating of hole walls and surfaces, followed by selective barrel plating to meet specifications. Vias are then filled and planarized to remove excess material and create a flat copper surface. The process is controlled to meet minimum thickness requirements defined in IPC-6012B, with cross-section analysis used to verify compliance.
Common issues associated with wrap plating include inadequate copper thickness, non-uniform plating, voids or air bubbles, cracks and delamination, poor adhesion, excessive plated bumps, and insufficient planarization, which can affect electrical and mechanical performance.
Wrap-plated PCBs are used across applications such as aerospace and defense, medical devices, and telecommunications, where electrical performance, reliability, and mechanical strength are required.
Click here to learn more about the wrap plating for PCBs by NetVia Group.
