https://cdn.pcbdirectory.com/news/Untitled_design_2__639122739643086675.webp712370
Ohmega Ticer, a manufacturer of embedded resistor materials and high-performance copper foil solutions for printed circuit boards and high-frequency electronics, provides TCR-EHF® ultra-low profile embedded resistor copper foil for high-frequency applications, designed for 5G mmWave, satellite communications, and other high-frequency electronics.
Ohmega Ticer Provides Ultra-Low Profile Embedded Resistor Copper Foil for High-Frequency Applications
Contact to learn more.
Ohmega Ticer’s TCR-EHF® embedded resistor copper foil is a thin film embedded resistor technology developed for next-generation electronics. The ultra-low profile structure supports signal integrity and reduced insertion loss in mmWave PCB substrate designs. As communications networks across 5G, satellite, defense, and automotive applications move toward higher frequencies, thinner copper foils are required to support performance and capacity.
TCR-EHF® addresses skin effect challenges in high-frequency circuits through a low-profile copper foil structure used in millimeter wave PCB antenna systems and phased array materials. The vacuum metallization process deposits nickel chromium (NiCr) and nickel chromium aluminum silicon (NCAS) alloys with uniform element ratios, supporting controlled resistance and electrical performance.
The technology is used in mmWave PCB substrate solutions and 5G embedded resistor applications for communications infrastructure, including beamforming networks, phased array antennas, and signal conditioning circuits. It is also applied across satellite and space systems, aerospace and defense applications such as AESA radar, satellite communication circuits, and military avionics, as well as automotive electronics including ADAS and EV systems, along with medical, industrial, and consumer electronics.
TCR-EHF® embedded resistor copper foil is designed for electrical performance across defined frequency ranges, supporting operation from DC to mmWave frequencies. The material shows minimal resistance change after thermal cycles and has a low thermal coefficient of resistivity, reducing resistance variation during lamination.
The product is available as a thin-film material or as a laminated product, with resistor values ranging from 10 to 100k ohms. It uses Grade 3 copper foil construction, supports multiple copper thicknesses, and is compatible with standard, high performance, lead-free, and specialty resins, including qualification on PPE/PPO laminates.
Performance characteristics include stable resistance after thermal cycles, and consistent electrical performance through controlled material composition and processing.
TCR-EHF® embedded resistor copper foil products are manufactured under controlled processes with testing and qualification, including RoHS compliance, laminate qualification across resin systems, and lot-to-lot consistency, with compatibility for standard PCB manufacturing processes.
Ohmega Ticer provides engineering support for implementing embedded resistor technology, including circuit modeling, resistor network optimization, thermal analysis, environmental testing, and manufacturing process development for high-frequency applications.
Click here to learn more about the TCR-EHF®.
Click here to download the brochure.
