OKI Circuit Technology Provides Comprehensive PCB Solutions for Next-Generation Semiconductor Testing

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OKI Circuit Technology Co., Ltd. delivers end-to-end printed circuit board (PCB) solutions—spanning design, analysis, manufacturing, and evaluation—while meeting the rigorous demands of today’s high-speed, high-density electronics market. With products ranging from high-speed/high-frequency PCBs and high-density, fine-pitch boards to rigid-flex PCBs, high-current/high-heat-radiation boards, and the proprietary T-SEC Board, OKI provides a one-stop partner for customers seeking advanced board technology and rapid production. Its service portfolio includes Design Solutions, Board Solutions, and an Express Board Service, ensuring fast turnaround without compromising quality.

Advanced Semiconductor Testing / ATE Solutions

As semiconductor technologies evolve toward higher speeds, larger wafers, and finer packaging, the need for high-precision, multilayer test boards has never been greater. OKI addresses this challenge with a dedicated line of Semiconductor Testing / Automated Test Equipment (ATE) boards engineered for exceptional electrical performance and mechanical reliability. These boards are designed to maintain signal integrity at high transmission rates and to accommodate the growing pin counts of next-generation devices. 

Probe Cards

Probe cards require ultra-precise processing to handle extremely tight pitches and high pin counts.

Capabilities: High-precision, multilayer construction with narrow pitch down to 0.65 mm

Specifications:

• Layers: 4 to 40
• Aspect ratio: 21 (varies with thickness)
• Max. dimensions: 480 × 480 mm
• Board thickness: up to 6.3 mm
• Materials: FR-4, FR-5 equivalent, polyimide
• Surface finish: electroless gold

Advantages: Parallel, simultaneous design shortens development cycles while ensuring production readiness. 

Performance / DUT Boards

For high-speed device characterization, OKI’s performance (DUT) boards provide best-in-class signal transmission and impedance control.

Capabilities: High-pin-count, narrow pitch down to 0.5 mm with transmission-channel simulation for top-rated electrical characteristics

Specifications:

• Layers: 4 to 40
• Aspect ratio: 21
• Max. dimensions: 488 × 630 mm
• Board thickness: up to 6.3 mm
• Materials: FR-4, FR-5 equivalent, polyimide
• Structure: PTH, pad-on-via
• Supported FBGA pitches: 0.5 mm, 0.65 mm, 0.8 mm
• Surface finish: electroless gold (up to 3 µm)

Burn-In Boards

Designed for reliability testing of high-pin-count devices, OKI’s burn-in boards offer robust construction for extended thermal and electrical stress testing.

Capabilities: High-integration, large multilayer boards for pin counts in the 1,000-pin class and narrow pitch down to 0.5 mm.

Specifications:

• Layers: 2 to 14
• Max. dimensions: 482 × 623 mm
• Board thickness: 1.6 mm and above
• Materials: FR-4, FR-5 equivalent
• Structure: PTH, pad-on-via
• Surface finish: HASL, electroless gold, or OSP
• Socket pitch: 0.5 mm and above

By integrating design expertise, high-precision fabrication, and rigorous evaluation, OKI Circuit Technology supports customers from concept to final production. Its ability to shorten development cycles through parallel, simultaneous design and special production readiness ensures that customers can meet aggressive time-to-market goals while achieving uncompromising quality.

From high-speed RF boards to complex semiconductor test platforms, OKI Circuit Technology stands as a trusted partner for industries demanding the highest levels of electrical performance, reliability, and manufacturing excellence.

Click here to learn more about Advanced Semiconductor Testing / ATE Solutions from OKI.