Schweizer Develops Bond PCB Technology for Bare Die Integration in HDI Designs

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Schweizer, a Germany-based company specializing in advanced printed circuit board (PCB) and embedding solutions, has developed bond PCB (bare die) technology as part of its HDI portfolio, enabling direct chip placement and electrical connection through wire bonding. The approach is designed to support compact, high-performance electronic systems across automotive and sensing applications.

The company’s BD-HDI (bare die/bond PCB) technology builds on chip-on-board (COB) concepts. In Schweizer’s implementation, semiconductor chips are mounted directly onto the PCB surface and connected electrically using wire bonding methods. This reduces the need for packaged components and helps lower system complexity.

Schweizer positions the technology for use in applications such as:

• Automatic gearbox electronics
• Camera and video monitoring systems for autonomous driving
• Sensor substrates (CPU, LiDAR, video)
• LED applications
• Chip-on-board (COB) substrates
• Control, automotive, satellite, and microsystems technology

A key feature of Schweizer’s bond PCB technology is the ability to integrate power components and logic areas on a single board. This can reduce overall system cost and footprint. The design supports up to 2,000 thermal cycles between -40°C and +165°C, targeting reliability requirements in automotive environments.

The company supports HDI stack-ups starting from four layers and enables mixed assembly processes, including glueing, soldering, and wire bonding. All wire bonding methods are supported, including Al thick and thin wire, Au ball-wedge, Au wedge-wedge, and Au ball-stitch-on-ball.

Schweizer supports low, medium, and high Tg-resistant base materials, including halogen-free and low-halogen materials for specific applications. Impedance requirements are considered in stack-up construction.

For surface finishes, Schweizer provides ENIG for aluminium wire bonding and ENEPIG or ENEPAG for gold wire bonding applications. The company also supports high-cleanliness requirements and offers packaging options such as antistatic and dissipative trays for handling sensitive components.

Click here to learn more about Schweizer's bond PCB technology.