TTM Technologies Manufactures HDI PCBs that use Advanced Microvia Technologies

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TTM Technologies develops and manufactures High-Density Interconnect (HDI) PCBs using its cutting-edge technologies that enable greater functionality and higher performance in next-generation electronic systems.

HDI PCBs from TTM feature laser-drilled microvias, sequential lamination structures, fine lines, and advanced thin materials, resulting in greater circuit density and more functionality per unit area. These designs support today’s high-speed, high-pin-count semiconductor devices with improved signal integrity and routing efficiency.

Advanced Capabilities: Microvias

TTM’s advanced HDI technology integrates multiple layers of copper-filled stacked microvias, enabling complex interconnections required for applications in 5G communications, IoT, medical wearables, autonomous systems, LiDAR, vehicle-to-everything (V2X) communications, and military platforms such as satellites and avionics.

A key highlight of TTM’s innovation is its microvia technology, offering drilled diameters as small as 0.004 inches (100µm) and pad diameters as small as 0.008 inches (200µm). These microvias can be configured as via-in-pad, offset, staggered, or stacked, and can be non-conductive filled, copper-plated, or solid copper filled, allowing superior routing flexibility for fine-pitch BGAs down to 0.25 mm.

TTM was among the pioneers of stacked microvia technology, enabling robust rout-out solutions for high-speed and micro-BGA designs. Building on this foundation, the company developed its NextGen-SMV® technology—representing the third generation of microvia innovation. This process also enables stacked microvia fabrication in just 5–7 days, requiring only a single lamination cycle. The result is reduced thermal stress, faster turnaround, and improved impedance control and electrical performance.

NextGen-SMV Technology 

The NextGen-SMV® process also enhances design flexibility by enabling any-layer-via connectivity through a metallurgical bond between conductive paste and copper layers. When paired with SMV® technology, it can also create solid copper vias for enhanced durability. Additionally, TTM’s NextGen Sub-Link Technology® allows multiple substructures—both high- and standard-performance—to be interconnected, optimizing material use and cost efficiency.

HyberBGA® and  CoreEZ® semiconductor packaging Technologies

Complementing its HDI capabilities, TTM also offers HyperBGA® and CoreEZ® semiconductor packaging technologies. HyperBGA® provides high-speed, radiation-tolerant solutions ideal for networking, telecommunications, defense, and medical applications, supporting 25-micron line and space geometries. CoreEZ®, built on the HyperBGA® platform, delivers 28-micron line and space precision and is designed for applications that demand high reliability and cost efficiency.

Through these advanced solutions, TTM Technologies continues to push the boundaries of HDI PCB manufacturing, meeting the growing performance and miniaturization demands of today’s most advanced electronic systems.

Click here to learn more about HDI PCB capabilities from TTM Technologies.