Wizlogix Provides Full Turn-Key PCB Services Across Design, Fabrication and Assembly

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Wizlogix Pte Ltd, a Singapore-based company providing PCB design, fabrication, and assembly services for electronics manufacturing, provides full turn-key PCB solutions, supporting electronic device development from concept to completion through integrated design, fabrication, component kitting, and assembly services. The company’s full turn-key service connects all stages of PCB production into a single process. It supports schematic design, PCB layout, placement, routing, and Gerber checking, followed by fabrication, component sourcing, and assembly through its network of industry-certified partners.

PCB layout design is handled by trained engineers with experience in software implementation, Gerber verification, and customer coordination. The company supports high-layer count boards, blind, buried, and micro vias, mixed-signal and high-power circuits. Additional capabilities include micro-BGA and BGA layouts, controlled impedance for single-ended and differential signals, HDI technology, COB, flex and rigid-flex designs, MCM, and RF design.

Design verification is carried out through DFM and DFT checks, compliance with IPC and military standards, EMC/EMI validation, high-speed rule checks, Gerber verification using CAM tools, and in-process cross-quality control. Deliverables include fabrication and assembly drawings, Gerber and drill data, design databases, and customized output files.

PCB fabrication is supported by a network of prototype specialists with regular and express production capabilities. The company supports rigid, flex, and rigid-flex boards, from prototype to high-mix low-volume builds, with up to 50 layers. Manufacturing covers a wide range of materials, including FR4, high-Tg, halogen-free, high-temperature PCBs, aluminium, polyimide, Teflon, and hybrid constructions, along with laminates such as Rogers, Nelco, Arlon, and DuPont.

Fabrication capabilities include fine trace widths and vias, via-in-pad, blind and buried vias, HDI structures, controlled impedance, and multiple surface finishes such as HASL, ENIG, immersion silver, ENEPIG, OSP, and gold finishes. Testing includes electrical testing, solderability, thermal stress, micro-section analysis, ionic contamination, hi-pot testing, and TDR measurement. Production is supported across Taiwan, Korea, China, Vietnam, Singapore, and the USA, and follows IPC standards including IPC 600, IPC 610, IPC 620, IPC J-STD 001, IPC 7711/7721, IPC CID, and IPC CID+.

Component kitting is managed through distributor partnerships, supplying components with certificates of conformance. The process supports prototyping through mid-volume production, including ex-stock sourcing, lead-time procurement, and ongoing support throughout fabrication.

PCB assembly is carried out by IPC-CIS-610 trained engineers. The company supports placement from large components such as PLCCs and QFPs to small 0201 chip sizes, with BGA capabilities up to 52 x 52 mm and 0.5 mm pitch. Assembly processes include SMT reflow, vapor-phase soldering, manual and wave soldering, BGA rework, stencil preparation, automated optical inspection, X-ray inspection, and functional testing. Board sizes up to 420 x 380 mm are supported, with manufacturing across Singapore, Malaysia, and Korea.

Wizlogix Pte Ltd also supports prototype and NPI production, high-mix low-volume manufacturing, handling of fine-pitch components including QFP, QFN, BGA, and CSP, SMT lead-free processes, manual soldering, and BGA rework, integrating all services within its full turn-key PCB solution.

Click here to learn more about the Wizlogix Pte Ltd services.