DIVISIO 1000

DIVISIO 1000

Depaneling Equipment by Asys Group Americas Inc (10 more products)

Note: Your request will be directed to Asys Group Americas Inc

Product Specifications

Product Details

  • Part Number
    DIVISIO 1000
  • Manufacturer
    Asys Group Americas Inc

General Parameters

  • Depaneling Mode
    Motorized
  • PCB Thickness
    0.5 to 4.5 mm
  • Max Board Length
    50 to 400 mm
  • Max Board Width
    50 to 350 mm
  • Separating Speed
    1000 mm/s
  • Max Component Height
    40 mm, partial 70 mm
  • Air Pressure
    6 bar, 120 Nl/min
  • Power Supply
    400 V, 208 V 50 / 60 Hz, ± 10%
  • Net Weight
    800 kg
  • Overall Dimensions
    1000 x 1200 x 1480 mm

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