VP2100

The VP2100 from ASSCON Systemtechnik-Elektronik GmbH is a Vapor Phase Vacuum Reflow Soldering Equipment that is equipped with Multi-Vacuum technology. It has single-lane transport and accommodates PCB sizes of up to 750 x 620 mm and components of up to 60 mm in height. This inline system has a soldering cycle that includes up to three vacuum steps per cycle to remove voids from the solder joint before the solidification phase has taken place.

The VP2100 enables oxygen-free soldering using vapor condensation and supports dynamic profiling, a process for automatically controlling the optimum soldering profile in series production and preventing overheating or destruction of electronic components. This reflow soldering equipment has a smart energy management system that reduces consumption by up to 70%. It supports full traceability, allowing complete process tracking to meet quality control and regulatory standards.