LASR2424F

Reflow Soldering Equipment by BOLD Laser Automation

Note: Your request will be directed to BOLD Laser Automation

The LASR2424F from Bold Laser Automation is an Automated Laser Reflow Soldering Equipment that is designed for solder reflow of flat and semi-chambered substrates. It is based on Bold’s industrial-hardened LPC architecture that integrates a 300-watt SPI/Trumpf continuous-wave fiber laser with galvanometer-based beam delivery which provides a tightly focused and highly stable optical process for the reflow soldering process. This machine has a Class 1 laser enclosure that meets CDRH and FDA laser safety standards. It delivers a laser centroid accuracy of ±0.037 mm and supports substrate sizes up to 600 x 600 mm. 

The LASR2424F has an integrated X-Y-Z motion control with closed-loop encoders and laser triangulation feedback for real-time focus correction. It has an inline and off-axis vision alignment that uses an OMRON or equivalent high-resolution machine vision for pre- and post-process inspection. This system improves overall production throughput with automated verification and mapping, reducing manual alignment steps. It is equipped with a vacuum chuck and pin tooling for precise fixturing of flat and curved substrates. This machine can be customized for flat-panel, hybrid, and microwave substrate processing, and can be configured with nitrogen or argon purge optics for debris-free operation.

Product Specifications

Product Details

  • Part Number
    LASR2424F
  • Manufacturer
    BOLD Laser Automation
  • Description
    Automated Laser Reflow Soldering Equipment with 300 W CW Fiber Laser

General Parameters

  • Heat Type
    Laser Heating
  • Max Pcb Width
    600 mm
  • Control Type
    NC/CAD-CAM
  • General Power
    0.3 kW

Technical Documents

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