BM-W645 G2

Reflow Soldering Equipment by e-Flex SMT Microsystems, Co. Ltd (20 more products)
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BM-W645 G2

The BM-W645 G2 from e-Flex SMT Microsystems, Co. Ltd is a Reflow Soldering Equipment with Heating Zone Length 2626 mm, Max Pcb Width 400 mm. More details for BM-W645 G2 can be seen below.

Product Specifications

Product Details

  • Part Number
    BM-W645 G2
  • Manufacturer
    e-Flex SMT Microsystems, Co. Ltd

General Parameters

  • Heating Zones
    6 Zones
  • Heating Zone Length
    2626 mm
  • Max Pcb Width
    400 mm
  • Control Type
    PC (Touchscreen & PLC as cheaper option)
  • Conveyor Direction
    Left-to-right
  • Conveyor Height
    900 ±20 mm
  • Conveyor Speed
    0 - 1500 mm/min
  • Conveyor Type
    Aluminum rails - Mesh belt + chain (stainless steel)
  • Mesh Belt Width
    450 mm
  • Cooling Method
    In-built Industrial Chiller
  • Heat Type
    Fully Forced Air Convection
  • Power Consumption
    9 kw
  • Power Supply
    380V 3 phase, 50 Hz (optional 220V, 3 ph/1 ph, 60 Hz)
  • Startup power
    37 kw
  • Temp Accuracy
    ±1 Degree C
  • Temp Range
    350 Degree C
  • Temperature control precision
    PID close-loop, SSR Drive
  • Net Weight
    800 Kg
  • Overall Dimensions
    3421 x 1120 x 1450 mm

Technical Documents
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