MD-2012

Reflow Soldering Equipment by Madell Technology Corporation (7 more products)

Note: Your request will be directed to Madell Technology Corporation

The MD-2012 from Madell Technology Corporation is a Reflow Soldering Equipment with Max Pcb Width 300 to 320 mm. More details for MD-2012 can be seen below.

Product Specifications

Product Details

  • Part Number
    MD-2012
  • Manufacturer
    Madell Technology Corporation
  • Description
    Automatic Lead-Free Reflow Oven MD-2012

General Parameters

  • Reflow Oven Type
    Desktop Reflow Oven
  • Temp Range
    280 Degree C
  • Max Pcb Width
    300 to 320 mm
  • Process Features
    Lead-Free Soldering Support
  • Power Supply
    220 V
  • General Power
    1500 W
  • Overall Dimensions
    430 x 370 x 260 mm
  • Net Weight
    12.5 kg

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