GDK-0802

Reflow Soldering Equipment by Shenzhen HTGD Intelligent Equipment Co., Ltd (16 more products)
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The GDK-0802 from Shenzhen HTGD Intelligent Equipment Co., Ltd is a Reflow Soldering Equipment with Max Pcb Width 400 mm ( optional: 610 mm). More details for GDK-0802 can be seen below.

Product Specifications

Product Details

  • Part Number
    GDK-0802
  • Manufacturer
    Shenzhen HTGD Intelligent Equipment Co., Ltd
  • Description
    GDK 8 Zone Air Reflow Oven with central support system

General Parameters

  • Cooling Zones
    2 Zones
  • Heating Zones
    8 Zones
  • Max Pcb Width
    400 mm ( optional: 610 mm)
  • Component Height
    45 mm
  • Control Type
    Siemens PLC+ Modular PLC+PID Control Windows 10
  • Conveyor System Type
    Rail
  • Conveyor Direction
    Left to Right, Right to Left
  • Conveyor Height
    900 ± 15 mm
  • Conveyor Speed
    400 to 2000 mm/min
  • Conveyor Type
    Chain
  • Cooling Method
    Water Chiller
  • Heating Technology
    Convection Heating
  • Exhausting Flow Per Port
    10 m³/min
  • General Power
    9 kW
  • Power Supply
    380 V
  • Startup power
    30 kW
  • Temp Accuracy
    ±1 Degree C
  • Reflow Oven Type
    Inline Reflow Oven
  • Temp Range
    300 Degree C
  • Temperature control precision
    PID Close loop control + SSR driving
  • Temperature deviation on PCB
    ± 1.5 Degree C
  • Net Weight
    2650 kg
  • Overall Dimensions
    5250 x 1420 x 1520 mm

Technical Documents
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