Note: Your request will be directed to TAMURA Corporation
The TNV25-308EM from TAMURA Corporation is a Reflow Soldering Oven that has 8 heating zones, each 3 m in length. It can accommodate PCB sizes of 50 x 50 mm to 250 x 330 mm and component height ranging from 10-30 mm (upper/lower). This oven requires an AC supply of 200 V and consumes 78 A of current. It has a footprint of 1310 x 3060 x 1374 mm and is ideal for the soldering process (heating and cooling) of solder paste in SMT applications.
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