SE3000-DD

The SE3000-DD by CyberOptics Corporation is a Solder Paste Inspection Equipment that supports PCB sizes from 510 x 310 mm to 510 x 510 mm. It has a field view of 21 x 21 mm and supports an optimum thickness of the PCB from 0.3 to 5 mm which can weigh up to 3kg. The equipment has an optimal top clearance space of 50 mm, edge clearance space of 3 mm, and bottom clearance space of 30 mm which allows the camera or sensor to move freely and capture clear images of the solder paste deposits on the PCB. The equipment has an imaging resolution of 9um that captures great high-resolution images which can eventually be mapped with an expectable imaging speed of 15 cm2 /sec.The SE3000-DD uses advanced imaging technology to analyze the solder paste deposits and detect any defects or inconsistencies. It is ideal for the measurement of the height, bridge, area, and volume of Printed Circuit Boards. The main form of a light source to illuminate the PCB surface during the inspection process is RGB, allowing for enhanced visibility and analysis of the solder paste deposits on the PCB. It is also to be noted that the equipment uses  Multi-3D sensors for imaging which produces 3-D images with MRS Technology.