SE3000-XL

Solder Paste Inspection Equipment by CyberOptics Corporation (8 more products)
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SE3000-XL

Product Specifications

Product Details

  • Part Number
    SE3000-XL
  • Manufacturer
    CyberOptics Corporation

General Parameters

  • Field of View
    36 x 36 mm(MRS Sensor), 21 x 21 mm(Ultra High Resolution MRS Sensor)
  • PCB Size
    50 x 120 mm(MRS Sensor), 1200 x 610 mm(Ultra High Resolution MRS Sensor)
  • PCB Thickness
    0.5 to 6 mm
  • PCB Weight
    10 kg
  • Imaging Resolution
    18 µm(MRS Sensor), 9 µm(Ultra High Resolution MRS Sensor)
  • Imaging Speed
    Peak: 35 cm2 /sec (2D+3D)(MRS Sensor), Peak: 15 cm2/sec (2D+3D)(Ultra High Resolution MRS Sensor), Average: 30 cm2/sec (2D+3D)(MRS Sensor), Average: 12 cm2/sec (2D+3D)(Ultra High Resolution MRS Sensor)
  • Top Clearance
    30 mm
  • Bottom Clearance
    35 mm
  • Edge Clearance
    Top: 3.0 mm (0.12 in.) Bottom: 3.0 mm (0.12 in.)
  • Net Weight
    2819 lbs
  • Overall Dimensions
    199 x 140 x 139 cm

Technical Documents
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