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Solder Paste Inspection Equipment by MagicRay Technology (4 more products)
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Product Specifications

Product Details

  • Part Number
    Icon-D
  • Manufacturer
    MagicRay Technology
  • Description
    3D SPI - Icon High Accuracy and High Performance 3D SPI

General Parameters

  • Field of View
    20 x 20 mm
  • Defects
    Insufficient Paste, Offset, Bridge, Shape
  • Air‑Pressure Requirements
    0.4 to 0.6 Mpa
  • PCB Size
    510 x 580 mm
  • Imaging Resolution
    5.5 µm, 10 µm, 12 µm, 15 µm
  • Imaging Speed
    400 to 450 ms/FOV
  • Height Resolution
    0.37 µm
  • Camera
    12 MP
  • Inspection Type
    3D
  • Conveyor Height
    900 ± 20 mm
  • Max. Solder Height
    600 um
  • Lighting
    3Color ring shape LED (RGB)
  • Pc Interface
    SMEMA
  • Net Weight
    1000 kg
  • Overall Dimensions
    1000 x 1360 x 1620 mm

Technical Documents
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