VSP3000

Solder Paste Inspection Equipment by MagicRay Technology (4 more products)
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Product Specifications

Product Details

  • Part Number
    VSP3000
  • Manufacturer
    MagicRay Technology
  • Description
    3D SPI-VSP3000 Fast Programming Without The Need Of Gerber File

General Parameters

  • Field of View
    20 x 20 mm
  • Defects
    Insufficient Paste, Offset, Bridge, Shape
  • Air‑Pressure Requirements
    0.4 to 0.6 Mpa
  • Measurement
    Pad Coverage, Paste Height, Paste Volume
  • PCB Size
    510 x 610 mm
  • Imaging Resolution
    10 µm, 12 µm, 15 µm
  • Imaging Speed
    400 to 450 ms/FOV
  • Height Resolution
    0.37 µm
  • Camera
    12 MP
  • Inspection Type
    3D
  • Conveyor Height
    900 ± 20 mm
  • Max. Solder Height
    600 um
  • Lighting
    3Color ring shape LED (RGB)
  • Pc Interface
    SMEMA
  • Net Weight
    900 kg
  • Overall Dimensions
    935 x 1360 x 1570 mm

Technical Documents
View more details on the manufacturer's website
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