ISO-Spector S30

Solder Paste Inspection Equipment by MEK Americas LLC (2 more products)

Note: Your request will be directed to MEK Americas LLC

The ISO-Spector S30 from Mek Americas LLC is a 3D Solder Paste Inspection Equipment. It has a CMOS Mono Camera that operates on phase shift & hybrid inspection principles and is also equipped with a 2D ring light & a 3D projector. This outline of the solder paste is extracted through the use of the 360-degree ring light that projects against inspection objects (solder paste).  It isolates solder paste on the PCB and performs 3D measurements to achieve more reliable inspections. The 3D projector unit creates strip patterns which are then captured by the camera and used to calculate the relative height of the solder paste.  

The ISO-Spector S30 has an inspection camera with a switchable inspection resolution of 25/12.5/8.5 µm or 20/10/7 µm and an inspection speed of up to 9400 mm²/sec. The camera's height (along the Z-axis) is adjusted automatically to compensate for the PCB warpage. It can accommodate PCBs with dimensions of up to 510 x 510 mm.  

The ISO-Spector S30 detects defects such as volume variations, projection, dimness, area discrepancies, shift, average height, bridging, no solder, coplanarity issues, and foreign material. It can detect solder smear and PCB contamination outside aperture detection and also has a glue detection option to check the correct glue application for wave-soldered SMT applications. This equipment generates live SPC data for printing trends and distribution histograms, enabling fast diagnosis of printing issues. It has a footprint of 938 x 1191 x 1480 mm and is ideal for factory automation, Industry 4.0, and quality improvement applications.

Product Specifications

Product Details

  • Part Number
    ISO-Spector S30
  • Manufacturer
    MEK Americas LLC
  • Description
    3D Solder Paste Inspection Equipment for PCB Sizes of up to 510 x 510 mm

General Parameters

  • Field of View
    50 x 50 mm
  • Defects
    Coplanarity, Volume, Height, Bridging, Insufficient solder, foreign material
  • Air‑Pressure Requirements
    0.3 to 0.4 Mpa
  • Measurement
    Shape Analysis, Paste Volume, Offset, Bridge Detection, Coplanarity
  • PCB Size
    510 x 510 mm
  • PCB Thickness
    0.3 to 5 mm
  • PCB Weight
    Less than 5 kg
  • Imaging Resolution
    25 µm, 12.5 µm, 8.5 µm
  • Imaging Speed
    9400 mm²/sec, 6000 mm²/sec, 3300 mm²/sec, 1400 mm²/sec
  • Height Resolution
    1 µm
  • Camera
    CMOS Mono Camera - Global shutter spec.
  • 3D Technology
    360° Moiré-Shadow free
  • Top Clearance
    5 mm
  • Inspection Type
    3D
  • Bottom Clearance
    50 mm
  • Pc Interface
    SMEMA
  • Net Weight
    600 kg
  • Overall Dimensions
    938 x 1191 x 1480 mm
  • PCB Warpage
    5 mm

Technical Documents

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